Nvidia introduced NVHBM, a custom High Bandwidth Memory architecture designed to deliver 30% more memory bandwidth, 15% lower power consumption, and more usable silicon area than conventional HBM4E, t…
ChangXin Memory Technologies (CXMT) announced on August 29, 2026 that it has begun mass production of LPDDR6 memory, the first commercial deployment of the standard, beating Samsung and SK Hynix. The …
Goldman Sachs warns that South Korea's rapidly aging population may prevent the country from fully benefiting from the AI-driven semiconductor boom, as the nation entered 'super-aged' status in 2024 w…
Goldman Sachs reports that South Korea's rapidly aging population may prevent its AI-driven economic boom from reaching ordinary households, as retail sales remain near 2019 levels despite surging chi…
SK Hynix broke ground on a more than $4 billion advanced packaging facility in West Lafayette, Indiana, its first U.S. production base for high-bandwidth memory (HBM) chips critical to AI systems. CEO…
SK Hynix has begun construction of a $4 billion memory fab in Indiana, its first US AI memory hub, with plans to begin packaging and testing High Bandwidth Memory (HBM) products from the production li…
SK Hynix said on Thursday (Aug 27) it will begin volume production of its next-generation HBM4E chips at its US$4 billion Indiana facility in the third quarter of 2029, with CEO Kwak Noh-Jung expectin…
SK Hynix will begin volume production of its next-generation HBM4E chips at its Indiana facility in the third quarter of 2029, with the site expected to reach annual capacity of hundreds of thousands …
SK Hynix held a groundbreaking ceremony for its $4 billion high-bandwidth memory (HBM) packaging facility at Purdue University in Indiana, a project aimed at boosting U.S. production of AI chips. The …
SK Hynix plans to begin volume production of HBM4E chips at its $3.87 billion to $4 billion Indiana facility in the second half of 2029, serving AI data centers run by Nvidia, Microsoft, and Google. T…
SK Hynix broke ground on August 27 on a $4 billion semiconductor facility in West Lafayette, Indiana, its first US manufacturing site, which will package high-bandwidth memory (HBM) chips for AI workl…
SK Hynix broke ground Thursday on a $4 billion advanced chip packaging and research facility in West Lafayette, Indiana, with cleanroom operations slated for the second half of 2028, aiming to localiz…
Nvidia is set to report fiscal second-quarter 2027 earnings on August 26, with analysts expecting roughly $92 billion in revenue and adjusted EPS of $2.09, representing about 97% year-over-year growth…
Apple's M6 Mac mini, announced August 25, starts at $899, a $300 increase over the M4 model, due to a DRAM shortage caused by AI infrastructure demand. Samsung, SK Hynix, and Micron have shifted produ…
TSMC's CoWoS advanced packaging capacity is sold out through 2025 and into 2026, with the supply-demand gap expected to narrow from around 20% to around 10% by the end of 2026, according to industry a…
Leopold Aschenbrenner's Situational Awareness Fund lost $35 billion of its $45 billion assets under management in about a month after running 4x leveraged bets on AI infrastructure stocks including SK…
The memory market is projected to grow nearly four-fold to over $837 billion by 2026, driven by AI demand for high-bandwidth memory (HBM), according to a Gartner forecast cited in EE Times Japan. Japa…
Goldman Sachs projects DRAM undersupply of 5.0% in 2026 and 5.9% in 2027, the tightest since 2017, driven by AI server demand. Micron Technology reported fiscal Q3 2026 revenue of $41.46 billion and n…
SK Hynix is pursuing multiple business development avenues involving fabs in China, Japan, Korea and the USA, Solidigm fund-raising, co-packaged optics, and high-bandwidth flash, as AI demand drives e…
NVIDIA Corp., Apple Inc., and Amazon.com Inc. are raising prices as AI-driven memory chip shortages push server DRAM prices to double in Q1 2026 and overall memory costs up 80% to 90% quarter-over-qua…