D-Matrix's Raptor accelerator, detailed in an ISCA 2026 paper, pairs a TSMC 4-nanometer logic die face-to-face with a custom DRAM die to reach up to 100 TB/s of bandwidth per card, with the paper repo…
Synopsys certified its digital and analog EDA flows on TSMC's A14 process and completed 64G UCIe IP tape-outs on TSMC's 2nm and 3nm nodes, part of a broader joint announcement around TSMC's Open Innov…
SemiAnalysis's STEEL teardown lab found that Intel's Panther Lake, the first commercial chip to use backside power delivery (PowerVia) and Intel's first gate-all-around RibbonFET transistors on the 18…
TSMC is introducing a new AI Design Kit (ADK) to enable AI-driven agentic workflows, announced at its Open Innovation Platform (OIP) event, according to Aveek Sarkar, director of ecosystem and allianc…
Qualcomm will fully unveil its Snapdragon 8 Elite Gen 6 smartphone chip at the Snapdragon Summit on September 22 in Maui, with the processor able to run a 30 billion parameter mixture-of-experts AI mo…
Global Unichip Corp. (GUC) announced on September 22, 2026 that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs, reaching data transfer speeds up to 16 Gbps o…
Qualcomm announced the Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro at Snapdragon Summit 2026 in Maui, with the Gen 6 Pro's Hexagon NPU able to run Mixture-of-Experts models of up to 30 b…
MediaTek confirmed its flagship laptop chip, the Dimensity CX C10 Max, will debut in an upcoming Lenovo Googlebook, following the first Googlebook laptops that launched with Intel or Qualcomm chipsets…
MediaTek introduced the Dimensity CX C10 Max, the inaugural SoC in its new Dimensity Compute Experiences (CX) family, built on TSMC's 3 nm process with an octa-core CPU, 11-core GPU, and MediaTek's 8t…
Nvidia's GeForce RTX 60 series, built on the architecture codenamed Rubin, is now targeting a 2028 launch window, according to leakers Kopite7kimi and Kepler_L2, a slip from earlier projections of 202…
Jeff Dean, former Chief Scientist at Google, said on the Dwarkesh Podcast in February 2025 that reinforcement learning and improved electronic design automation could cut cutting-edge chip design time…
Huawei announced at its Connect event that it plans to release the Ascend 960 DT AI chip in the first quarter of 2027 as part of a roadmap of ten new AI chips covering data centers and small devices, …
TSMC and Samsung both committed to ASML's High-NA EUV lithography roadmap on September 8, with TSMC targeting high-volume manufacturing for advanced nodes starting in 2030 and Samsung planning High-NA…
TSMC's CoWoS-L is expected to remain the mainstream advanced packaging solution for AI chips through 2028 despite competition from Intel's EMIB-T, according to TrendForce research, which cites CoWoS-L…
Rep. John Moolenaar, the Michigan Republican who chairs the House Select Committee on the Chinese Communist Party, sent a letter to Commerce Department official Jeffrey Kessler urging the Trump admini…
AWS launched its R9g and R9gd memory-optimized EC2 instances on August 31, the first tier of the Graviton5 family to reach general availability. AWS claims the new chips deliver 25% more compute per v…
GlobalFoundries and Marvell Technology are expanding their silicon photonics collaboration to target next-generation optical interconnects for AI data centers, aiming for 400G-per-lane optics with pow…
AI safety arguments that treat algorithmic progress as an exogenous factor with a fixed 3-10x annual rate are flawed because algorithmic progress is driven by the AI ecosystem itself, according to an …
TSMC Co-COO Y.J. Mii said at a career forum at National Taiwan University that the chipmaker is taking a cautious internal stance on AI adoption, comparing the technology to a 'three-year-old superman…
MediaTek unveiled the Dimensity 9600 Pro and Dimensity 9600M flagship mobile processors, with the 9600 Pro built on TSMC's 2nm (N2P) node and the 9600M on 3nm. MediaTek claims the 9600 Pro delivers up…