Oppo confirmed the Find X10 Pro Max will launch in China on September 22 running MediaTek's Dimensity 9600 Pro, the first mobile chip built on TSMC's 2nm N2P process, with MediaTek claiming up to 61% …
MediaTek announced its Dimensity 9600 Pro and 9600 M flagship 5G Agentic AI chips on September 15, 2026, with the 9600 Pro built on TSMC's 2nm process and delivering a 51% boost in large language mode…
MediaTek unveiled its Dimensity 9600 Pro and 9600M phone processors on Tuesday, with the 9600 Pro becoming the company's first chip built on TSMC's 2-nanometer process and both chips supporting consol…
Fujitsu announced on September 14 that it will begin global sales of FUJITSU-MONAKA, a 144-core 2-nanometer Arm server CPU, in November 2026, targeting AI inference workloads for banks, telecoms and g…
Apple's first 2nm iPhone places the company at the front of a new chip race, according to Forbes contributor Jon Markman, with TSMC supply, rising costs and on-device AI raising the stakes. The report…
A strategy report co-authored by former European Commission Executive Vice-President Margrethe Vestager, "A Transformative AI Strategy for Europe," was released on September 14 and proposes €100 billi…
Dennis Bloch, counselor for economic affairs at the German Embassy in Seoul, told the Jeonnam-Gwangju Integrated Special Metropolitan City Semiconductor and AI Transformation Global Forum in Gwangju o…
Apple and TSMC unveiled the A20 Pro on September 9 at Apple's "Surprise and Shine" event, the first iPhone chip built on TSMC's 2 nanometer (N2) process node, which will power the iPhone 18 Pro, iPhon…
TSMC plans to double its CoWoS advanced packaging capacity to 260,000 wafers per month by 2028, up from an estimated 130,000 by the end of 2026, according to 科技新報 TechNews. The current CoWoS bottlenec…
AI inference chip startup d-Matrix plans to integrate its Raptor XPU into Nvidia's MGX rack architecture by Q4 2027, with a first Raptor tape-out expected before the end of 2026. D-Matrix says Raptor,…
Apple's newly unveiled A20 Pro processor is the global commercial debut of TSMC's 2-nanometer fabrication node, powering the iPhone 18 Pro and foldable iPhone Duo, according to the company. The chip r…
ASML has revealed a Hyper-NA EUV roadmap extending beyond 2030, a plan Japanese press including EE Times Japan views as the de facto industry standard that will test Japan's semiconductor supply chain…
OpenAI is diversifying its custom AI chip manufacturing to Samsung Electronics, moving beyond its initial reliance on TSMC for the Jalapeno chip co-designed with Broadcom, OpenAI Korea General Manager…
Apple CEO John Ternus debuted the redesigned Siri AI and the A20 Pro chip at the 'Surprise and Shine' event on September 9, with Siri AI running on Google's Gemini technology under a deal reportedly w…
Apple launched the iPhone 18 Pro and 18 Pro Max featuring the A20 Pro, its first 2-nanometer chip, a main camera with a true variable aperture, and what Apple claims is the largest battery leap ever i…
OpenAI and Samsung Electronics are deepening their partnership to co-develop next-generation AI chips, with OpenAI Korea General Manager Harrison Kim confirming the collaboration at a press conference…
OpenAI is deepening cooperation with Samsung Electronics on next-generation chips, with joint production and research underway, according to Harrison Kim, General Manager of OpenAI Korea, who spoke at…
Arm Ltd. announced the Neoverse CSS N4 (codenamed Ranger), a 128-core cloud server CPU on TSMC's N3P process with 256 MB of L3 cache, PCIe Gen 7, CXL 4.0, and LPDDR6 memory support, targeting a 2x soc…
Intel and ASML announced on September 8 that Intel has processed more than one million wafers on High-NA EUV equipment, a total exceeding all other chipmakers combined, with Intel's Panther Lake chips…
ASML and TSMC are developing larger photomasks to enable smaller chip features, according to a report from The Register. The companies aim to increase the mask size from the current 6x6 inches to 6x12…