TSMC’s CoWoS Shortage: Why Nvidia and Cloud Giants Are Sourcing Amkor and UMC Capacity
TSMC plans to double its CoWoS advanced packaging capacity by 2028 to 260,000 wafers per month, up from an estimated 130,000 by the end of 2026, driven by strong AI chip demand.
AsiaAI Publisher · September 12, 2026 · 2 min read · Source: 科技新報 TechNews · Issue #94
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This story ran in Issue #94, alongside three other stories.
Semiconductors & Hardware
TSMC plans to double its CoWoS advanced packaging capacity by 2028 to 260,000 wafers per month, up from an estimated 130,000 by the end of 2026, driven by strong AI chip demand. The current CoWoS bottleneck is creating overflow business for other packaging providers like UMC and Amkor. Intel is also positioning its EMIB-T packaging as an alternative, particularly for custom AI chips from customers like Google and Amazon.
TSMC’s CoWoS technology is critical for high-performance AI accelerators, particularly NVIDIA’s GPUs, which rely on its high bandwidth and low latency. This expansion indicates the continued tight supply for advanced AI chips and the broader industry’s scramble to secure packaging capacity beyond just wafer fabrication.