TSMC plans to double its CoWoS advanced packaging capacity to 260,000 wafers per month by 2028, up from an estimated 130,000 by the end of 2026, according to 科技新報 TechNews. The current CoWoS bottlenec…
United Microelectronics Corporation (UMC) announced a phased expansion plan approved by its Board of Directors, including immediate cleanroom capacity expansion in Singapore and construction of a new …
Tata Electronics is building India's first commercial semiconductor fabrication plant, an $11 billion facility in Dholera, Gujarat, targeting mature process nodes between 28 nm and 110 nm for automoti…
TSMC and Winbond are collaborating to build a localized DRAM supply chain in Taiwan using 3D wafer-on-wafer stacking technology, targeting edge AI workloads. The partnership leverages Winbond's CUBE a…
HyperLight, a Harvard spinout developing thin-film lithium niobate optics for AI data centers, raised $80 million from chip designer MediaTek, contract manufacturers Foxconn and Jabil, and other hardw…