United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced that its Board of Directors has approved a phased expansion plan to meet growing customer demand. The company will immediately expand cleanroom capacity in Singapore and simultaneously begin construction of a new fab building shell at its flagship Tainan campus in Taiwan.
This dual-track approach is designed to meet near-term customer demand while establishing the structural footprint required to capture future high-growth AI and edge-computing applications. The strategy dramatically reduces future capacity lead times while keeping near-term capital expenditure tightly aligned with secured, long-term customer commitments.