Qualcomm and MediaTek are preparing to launch their next-generation flagship chips, the Snapdragon 8 Elite Gen 6 Pro (SM8975) and Dimensity 9600 Pro, both fabricated on TSMC's 2nm N2P process, accordi…
Xiaomi introduced its in-house XRing O3 processor, built on TSMC's 3nm N3P process, which will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max in September. The chip features an all-big-core CPU,…
TSMC's CoWoS advanced packaging technology, used for AI accelerators with high-bandwidth memory (HBM), faces yield issues and capacity constraints, creating an opportunity for Intel to win foundry cus…
Xiaomi unveiled three TSMC-fabbed Xring chips, including the 3nm O3 flagship phone SoC, the 6nm O100 NPU for on-device MiMo LLM, and the 3nm D100 for autonomous driving, aiming to reduce reliance on Q…
Linux networking maintainers say AI-generated patches have left them 'completely overwhelmed,' with 632 fixes and 648 feature patches merged for Linux 7.3, and an estimated one-third to one-half of th…
Google's Pixel 11 series, powered by the Tensor G6 chip, shows only modest performance gains in benchmark tests, with single-core performance up 18% and multi-core up 21% in Geekbench 6, according to …
Marvell Technology announced discussions with Google to develop custom AI, storage, and networking chips, including a Memory Processing Unit and an inference-optimized TPU, with the MPU design targete…
The UK Space Agency is providing £13 million (US$17.6 million) in funding to 16 projects to develop next-generation satellite technology, including improving Wi-Fi on ScotRail's West Highland line and…
Lenovo's Idea Tab Pro tablet is available on Amazon for $299.99, a 12% discount from its regular price, as part of an ongoing deal. The tablet features a 12.7-inch 3K LCD display, MediaTek Dimensity 8…
Google's Tensor G6 processor, powering the Pixel 11 series, prioritizes AI, efficiency, and security over raw CPU and GPU performance, featuring a seven-core CPU, PowerVR GPU, and a fifth-generation T…
Citadel Securities projects that more than $500 billion in new public and private debt will be issued by 2028 to fund AI chips and data centers, with AI capital expenditures expected to reach $600 bil…
Citadel Securities projects more than $500 billion in additional public and private debt issuance by 2028 to finance AI data center chips, with AI capital expenditure expected to climb to roughly $600…
MediaTek is lining up $5 billion in financing to expand into AI datacenter silicon, targeting a slice of a market it expects to be worth up to $80 billion next year. The Taiwanese chipmaker aims to ca…
Intel's EMIB packaging technology is gaining traction as TSMC's CoWoS advanced packaging lines are booked through 2027, with Google committing to order more than 3 million units of Intel's EMIB-T for …
ChipAgents closed a $60 million Series A2 round on July 29, bringing its total Series A to $134 million, with chipmakers Micron and MediaTek among the backers. The company's multi-agent platform compr…
Intel's EMIB (Embedded Multi-die Interconnect Bridge) packaging technology has secured Google, Amazon, Cisco, SpaceX, and Tesla as external customers, with Google adopting EMIB-T for its 9th-generatio…
TSMC is developing a new chip packaging technology called CoPoS (Chip-on-Panel-on-Substrate) that replaces traditional circular 300mm wafers with rectangular 310×310 mm panels to increase usable surfa…
OpenAI president Greg Brockman confirmed the company is building 'a family of devices' that will arrive 'soon,' centered on voice interaction with ChatGPT rather than typing. Brockman dismissed Apple'…
ChipAgents, the AI semiconductor design startup founded by University of California, Santa Barbara professor William Wang, has raised $60 million in new financing, Reuters reported on July 29th, follo…
ChipAgents has secured an additional $60 million in Series A2 financing, expanding its Series A round to $134 million, as the company's AI agents for semiconductor design are deployed at over 120 chip…