MediaTek, the world's number one provider of mobile chipsets, today announced the launch of the Dimensity 9600 Pro. This flagship SoC achieved a significant technological milestone, adopting the new 2 nm process node; as the first company to announce reaching this threshold, MediaTek is showcasing its leadership in innovation with the Dimensity Pro 9600. With the next generation of silicon now available in the Dimensity lineup, the Dimensity 9600 Pro will enable many transformative capabilities, combining flagship performance and power efficiency with advanced agentic AI experiences.
"AI is central to the smartphone experience, and devices need greater performance, efficiency, and intelligence to keep pace with rapidly evolving user demands," said JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit. "The Dimensity 9600 Pro meets these demands with a Native AI architecture and dual improvement in performance and power efficiency to deliver new agentic AI experiences."