TSMC plans to double its CoWoS advanced packaging capacity to 260,000 wafers per month by 2028, up from an estimated 130,000 by the end of 2026, according to 科技新報 TechNews. The current CoWoS bottlenec…
SK Hynix's first U.S. high-bandwidth memory (HBM) advanced packaging facility, a $4 billion project in Indiana, will begin commercial production of HBM4E chips in the second half of 2029, aiming to cl…
Terafab, backed by Tesla, SpaceX, and xAI with a reported $16.8 billion first phase, is testing a vertically integrated semiconductor fab model that combines logic, memory, and advanced packaging unde…
NVIDIA and its partners announced a $500 billion commitment to build AI infrastructure across the United States, with semiconductor production underway at TSMC's Arizona facility and new AI systems fa…
NVIDIA and its partners are investing in American manufacturing, supply chains, and energy grids to produce AI infrastructure, including advanced chips and systems, aiming to reinvigorate U.S. industr…