TrendForce's latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging. Although TSMC's CoWoS-L faces competition from Intel's EMIB-T, its advantages in technology maturity and yield are expected to keep it the mainstream packaging solution for AI chips through 2028.
TrendForce notes that strong AI demand continues to support NVIDIA's push toward integrated GB/VR rack-scale solutions, which incorporate large numbers of chips. NVIDIA's high-end GPU shipments are expected to grow approximately 30% YoY in 2026. AMD, meanwhile, is aggressively promoting its MI400/MI450 series beginning in the second half of 2026, providing further momentum to overall shipments.