TSMC's CoWoS-L is expected to remain the mainstream advanced packaging solution for AI chips through 2028 despite competition from Intel's EMIB-T, according to TrendForce research, which cites CoWoS-L…
Micron Technology at Hot Chips 2026 detailed how high-bandwidth memory (HBM) and advanced packaging are central to AI system design, citing a widening gap where AI accelerator TFLOPS grow 3x every two…
Intel reported its highest growth in server CPUs in fifteen years during the second quarter of 2026, driven by demand for AI host CPUs and agentic AI sandboxes that execute work on CPU clusters. CEO L…
AMD announced the Instinct MI455X, its first GPU designed for rack-scale AI deployments, based on the new CDNA5 architecture and featuring 256 Work Group Processors, 432 GB of HBM4 memory at 23.3 TB/s…
Nvidia canceled a planned quad-die version of its Rubin Ultra AI accelerator, shifting to a dual-die design due to manufacturing execution concerns. The change moves from highly integrated CoWoS-L pac…