Researchers at UNIST and Hanbat National University in South Korea, and engineers in Japan, presented alternative memory chip designs at the IEEE VLSI Symposium that stack DRAM dies side by side inste…
High Bandwidth Flash (HBF), a NAND-based memory stack with read bandwidth comparable to HBM4 but 10x the capacity, is set to sample from Sandisk in late 2026 and appear in AI inference devices by earl…
Samsung Electronics reported a second-quarter operating profit of 89.4 trillion won ($58.4bn), a 19-fold increase year-over-year, driven by surging demand for AI memory chips. Revenue more than double…
UBS advises investors to buy SK Hynix's upcoming American Depositary Receipts on Nasdaq and sell its Korean-listed shares ahead of a historic $29 billion ADR launch on July 10, 2026. The Swiss bank ex…
PhantaField's Sophon PFG-1 AI ASIC integrates 330 GB of on-die DRAM using a monolithic 3D architecture, eliminating the need for high-bandwidth memory (HBM) to overcome the memory wall in large langua…
Sophon PFG-1, a monolithic-3D AI ASIC with 330 GB of on-die DRAM and no HBM, delivers 2,100 TFLOPS BF16 and 4,200 TFLOPS FP8 on a 750 mm² die, achieving up to 174× the tokens-per-watt of NVIDIA Rubin …
Micron Technology's HBM4 memory chip is ramping production at twice the speed of its predecessor HBM3E, with full allocation for 2026. The company's fiscal Q3 2026 results crushed Wall Street estimate…
Micron Technology reported fiscal Q3 2026 revenue of $41.46 billion, crushing Wall Street estimates by nearly $6 billion, driven by AI-fueled demand for memory chips. Adjusted EPS of $25.11 also beat …
Micron Technology reported fiscal third-quarter revenue of nearly $42bn, quadrupling year-over-year, driven by surging demand for high-bandwidth memory used in AI accelerators. Gross margins exceeded …
SK Hynix briefly surpassed Samsung Electronics to become South Korea's most valuable company, reaching a $1.35 trillion market cap on June 22, 2026, driven by surging demand for its high-bandwidth mem…
Samsung Electronics reviewed strategies to expand sales of high-bandwidth memory (HBM) chips and discussed long-term supply agreements with major customers at a global strategy meeting, amid surging d…
Nvidia's Vera Rubin NVL72, announced at CES and detailed at GTC, promises up to 10x lower cost per token than Blackwell, but the headline figure depends on ideal conditions: mixture-of-experts models,…
Nvidia Corp is strengthening its artificial intelligence platform by integrating Micron's HBM4 memory technology. The partnership aims to enhance AI computing performance and efficiency for next-gener…
Nvidia CEO Jensen Huang met SK Group Chairman Chey Tae-won in Taipei on June 1 to discuss artificial intelligence memory cooperation, according to a post on SK Group's Facebook account cited by Yonhap…
Samsung Electronics began shipping samples of its 12-layer HBM4E high-bandwidth memory chips on May 29, beating its own second-half 2026 target and achieving speeds of 16 Gbps per pin. The company’s s…
Samsung Electronics shipped samples of its sixth-generation HBM4 AI memory chips to global customers, sending its shares up roughly 6%. The move marks the company's most aggressive push into the AI ha…
Broadcom added South Korea's FuriosaAI to its roster of partners building AI accelerators on Broadcom's packaging and networking technology. FuriosaAI claims its third-generation processor will be fab…