Micron Technology (NASDAQ:MU) trades at $910.43, up 674.9% over the past year, with 24/7 Wall St. setting a 12-month price target of $954.59 (4.85% upside) and a HOLD recommendation at 90% confidence …
SK hynix is collaborating with TSMC and Intel Foundry to integrate its HBM4 memory into advanced packaging technologies, including Intel's EMIB, as disclosed at Hot Chips 2026. The collaboration aims …
D-Matrix unveiled Raptor, a datacenter inference accelerator that bonds 3D DRAM directly to the logic die, eliminating the memory PHY, at Hot Chips 2026. The card delivers 32GB of capacity at over 100…
SK hynix detailed its advanced packaging roadmap for High-Bandwidth Memory (HBM) at Hot Chips 2026, focusing on HBM4 and beyond, with plans to double TSV counts, increase I/O speeds, and integrate log…
Micron Technology at Hot Chips 2026 detailed how high-bandwidth memory (HBM) and advanced packaging are central to AI system design, citing a widening gap where AI accelerator TFLOPS grow 3x every two…
Micron CEO Sanjay Mehrotra said artificial intelligence has changed the memory industry's traditional boom-and-bust cycle by creating sustained demand for high-bandwidth memory and other data-center p…
Micron Technology (NASDAQ:MU) trades at $937.11 with a 24/7 Wall St. 12-month price target of $966.70, implying 3.16% upside and a HOLD rating with 90% confidence. The stock has surged 228.54% year to…
NVIDIA reported Q1 FY27 revenue of $82 billion, up 85% year-over-year, with data center revenue at $75 billion, and guided Q2 revenue to $91 billion, while Micron Technology reported fiscal Q3 revenue…
Sandisk taped out its first High Bandwidth Flash (HBF) memory die, a milestone announced at its 2026 Investor Day on August 13, with first HBF inference product samples targeted for 2027. The first-ge…
SK hynix reported record quarterly revenue and operating profit in the second quarter, surpassing KRW 100 trillion in cumulative first-half revenue for the first time, driven by AI memory demand. Ryu …
SanDisk's High Bandwidth Flash technology delivered 12.8 TB/s of memory bandwidth with 4 TB of capacity per GPU in simulation, closing to within 2.2% of HBM bandwidth for inference workloads. The stac…
AMD's Instinct MI455X accelerator, unveiled at the 2026 Advancing AI event, introduces the CDNA 5 architecture, delivering 4x peak FP4/FP8 matrix performance and 2x other compute versus the MI355X, bu…
A new paper from Google DeepMind, co-authored by Turing Award winner David Patterson and Xiaoyu Ma, argues that the biggest obstacle to scaling large language model inference is memory, not raw comput…
SK hynix showcased a full-stack AI memory portfolio at Future of Memory and Storage 2026, held August 4-6 at the Santa Clara Convention Center, including 16-layer 48GB HBM4, wafer-bonded 375-layer 4D …
South Korea is restructuring its workforce as top students shift from law and medicine to electrical engineering and materials science, driven by the AI chip boom and HBM demand, with pay gaps reversi…
Samsung Electronics warned during its Q2 2026 earnings call that AI-driven memory chip shortages will intensify in 2027 and persist through at least 2028, sending Micron Technology shares up approxima…
Samsung Electronics unveiled a new 3D-memory roadmap, including zHBM and zNAND-O, claiming the zHBM system delivers about eight times the performance and over 10 times the memory density of next-gener…
KIOXIA America, Inc. announced the KIOXIA GP1 Series PCIe 6.0 NVMe SSD, the first product in its GP Series of Super High IOPS SSDs optimized for GPU direct access, delivering up to 10 million random r…
Samsung Electronics reported record quarterly revenue of ₩171.5 trillion ($118.7 billion) and operating profit of ₩89.5 trillion ($62 billion) for Q2 2026, up 130% and 1,812.4% year-over-year respecti…
Samsung Electronics and SK Hynix posted a combined 150 trillion won in operating profit for the quarter ended June 30, with Samsung reporting 89.5 trillion won and SK Hynix 60.5 trillion won, both rec…