SK Hynix held a groundbreaking ceremony for its $4 billion high-bandwidth memory (HBM) packaging facility at Purdue University in Indiana, a project aimed at boosting U.S. production of AI chips. The facility, announced in 2026, is expected to strengthen the domestic supply chain for advanced memory chips used in artificial intelligence applications.
Article URL: https://www.reuters.com/world/asia-pacific/sk-hynix-holds-groundbreaking-ceremony-4-billion-indiana-ai-chip-packaging-2026-08-27/
Comments URL: https://news.ycombinator.com/item?id=49466604
Points: 1
EU-based hosting, git-push deploys, automatic HTTPS, no cold starts. Free tier with a custom domain — perfect for shipping the agent you just read about.