SK hynix CEO Kwak Noh-jung said at the Aug. 26 groundbreaking that its $4 billion-plus Indiana fab will deliver the first 'Made in USA' HBM products, but the DRAM wafers will be made in South Korea an…
A developer argues that AI-generated code has shifted the bottleneck from writing to reviewing, citing data showing increased pull request volumes and review times, plus higher bug rates. Studies and …
Researchers at Purdue University, Yi Ding and Ruqi Zhang, found that teacher supervision in on-policy distillation is largely noise, and larger teacher models produce more noise. They introduced On-Po…
SK Hynix's first U.S. high-bandwidth memory (HBM) advanced packaging facility, a $4 billion project in Indiana, will begin commercial production of HBM4E chips in the second half of 2029, aiming to cl…
SK Hynix broke ground on a more than $4 billion advanced packaging facility in West Lafayette, Indiana, its first U.S. production base for high-bandwidth memory (HBM) chips critical to AI systems. CEO…
SK hynix held a groundbreaking ceremony on Aug. 27 for its first U.S. AI memory production hub in West Lafayette, Indiana, a 133-acre fab that will supply next-generation HBM to U.S. customers startin…
SK hynix Inc. broke ground on its first U.S. High Bandwidth Memory (HBM) advanced packaging production facility in West Lafayette, Indiana, with mass production targeted for Q2 2029. The ceremony at P…
SK hynix Inc. held a groundbreaking ceremony on August 27, 2026, for its first U.S. High Bandwidth Memory (HBM) production facility in West Lafayette, Indiana, with an investment of over $4 billion. T…
SK hynix formally launched its $3.87 billion advanced chip packaging project in Indiana, which will produce the first high bandwidth memory (HBM) made in the US, with mass production slated for the th…
SK Hynix held a groundbreaking ceremony for its $4 billion high-bandwidth memory (HBM) packaging facility at Purdue University in Indiana, a project aimed at boosting U.S. production of AI chips. The …
SK Hynix broke ground on August 27 on a $4 billion semiconductor facility in West Lafayette, Indiana, its first US manufacturing site, which will package high-bandwidth memory (HBM) chips for AI workl…
A peer-reviewed study in npj Climate Action finds that AI-driven productivity gains in fossil fuel production will likely offset emissions reductions from AI-enhanced renewables, increasing carbon pol…
Semiconductor equipment OEMs are turning to build-to-print contract manufacturing to meet rising demand from AI and high-performance computing, avoiding costly in-house expansions. Suppliers operating…
Angel Contreras, 30, a former Marine studying mechanical engineering at City College of San Francisco, is pursuing his dream of building race cars after an AI chatbot's answer about materials science …
SK hynix will break ground on Aug. 27 on its $3.87 billion advanced chip packaging plant in West Lafayette, Indiana, for high-bandwidth memory used in AI processors. The South Korean memory maker, whi…
U.S. universities are rapidly expanding AI courses and degree programs beyond computer science as hiring for entry-level software developers slows and computer science enrollment drops 8% this spring,…
College enrollment in computer and information science programs has declined by more than 8% at four-year institutions from spring 2025, according to the National Student Clearinghouse Research Center…
Researchers from Nace AI and Purdue University have introduced HyperNetwork-based knowledge injection as a third path for integrating proprietary data into LLMs, backed by the first systematic scaling…
Saurabh Bagchi, a professor at Purdue University and director of the NSF CISE Center Chorus, will present a talk examining AI's dual impact on computing system reliability and security, highlighting b…
Chris Fall, director of the U.S. Center for AI Standards and Innovation, resigned after three months, leaving the federal AI testing institute without permanent leadership. The Commerce Department con…