SK hynix will hold a groundbreaking ceremony on Aug. 27 for its $3.87 billion advanced chip packaging plant in Indiana, as the South Korean memory maker steps up its US expansion in artificial intelligence chip production.
The ceremony will take place in West Lafayette, Indiana, where SK hynix is building an advanced packaging facility and research center for high-bandwidth memory, according to industry sources Thursday. The company has begun sending invitations to major customers and business partners.
SK Group Chairman Chey Tae-won and SK hynix Chief Executive Kwak Noh-jung are expected to attend, along with executives from major technology companies and suppliers.
The ceremony could also bring Chey and Nvidia CEO Jensen Huang together again, though Huang’s attendance has not been confirmed. The two have met several times in recent months as SK hynix deepens its ties with Nvidia over HBM chips and AI infrastructure.
The ceremony could also put renewed focus on SK hynix’s plans for further investment in the US.
Chey said after the company’s US depositary receipt listing last month that SK hynix was considering additional investment beyond the Indiana project. He said building a memory production facility in the US could also be an option if conditions including power, water, labor and supply-chain infrastructure were in place.
SK hynix announced the Indiana project in 2024, saying it would invest $3.87 billion in an advanced packaging plant and research and development facility near Purdue University.
The company plans to begin mass production in the second half of 2028. The site will package HBM, a type of memory that stacks multiple DRAM chips to deliver the bandwidth required by AI processors.
The US government has committed up to $450 million in direct funding and $500 million in loans for the project under the CHIPS Act.
Site preparation and concrete work began earlier this year, with the Aug. 27 ceremony expected to mark the start of full-scale structural construction.
The Indiana facility will give SK hynix a US-based production base for advanced HBM packaging as demand for AI-related memory continues to rise.
herim@heraldcorp.com