SK hynix Inc. (or "the company", www.skhynix.com) is opening a new future for AI cooperation between the United States and South Korea by establishing a first next-generation High Bandwidth Memory (HBM) production hub in the US. SK hynix announced today that it held a groundbreaking ceremony for an advanced packaging production facility for AI memory on the 27th (local time) at the Holloway Gymnasium, Purdue University, located in West Lafayette, Indiana.
The groundbreaking ceremony was attended by prominent US government and political figures, including Indiana Governor Mike Braun, US Senator Todd Young, Purdue University President Mitch Daniels, and Chairman of the Korea-US Alliance Foundation Robert Abrams. Kang Kyung-wha, Ambassador of South Korea to the United States, was also present at the event. From the SK Group, Vice Chairman Yu Jeong-Joon, Vice Chairman Lee Hyung-hee, CEO of SK hynix Kwak Noh-Jung attended.