▪ Investing over $4 billion in Indiana fab and first ‘Made in USA’ next-generation HBM mass production in U.S. to begin in H2 2029
▪ Help stabilize the U.S. semiconductor supply chain and contribute to strengthening U.S. national security and economy
▪ Establishing a semiconductor ecosystem with more than 100 partners and creating 7,000 direct/indirect local jobs
▪ MOU with Purdue University for R&D collaboration on next-generation advanced packaging technology
▪ Recruitment of USFK(US Forces Korea) veterans, contributing to a stronger US-Korea alliance
▪ CEO Kwak Noh-Jung “We will become the most trusted partner in the U.S., where top-tier customers, R&D capabilities, and partners align”
Seoul, August 28, 2026 – SK hynix Inc. (or “the company”, www.skhynix.com) is opening a new future for AI cooperation between the United States and South Korea by establishing a first next-generation High Bandwidth Memory(HBM) production hub in the US.
SK hynix announced today that it held a groundbreaking ceremony for an advanced packaging* production facility for AI memory on the 27th(local time) at the Holloway Gymnasium, Purdue University, located in West Lafayette, Indiana.
The groundbreaking ceremony was attended by prominent US government and political figures, including Indiana Governor Mike Braun, US Senator Todd Young, Purdue University President Mitch Daniels, and Chairman of the Korea-US Alliance Foundation Robert Abrams. Kang Kyung-wha, Ambassador of South Korea to the United States, was also present at the event. From the SK Group, Vice Chairman Yu Jeong-Joon, Vice Chairman Lee Hyung-hee, CEO of SK hynix Kwak Noh-Jung attended.
Investment of Over $4 Billion for First US HBM Production Base Creating Synergy with Korea
The Indiana fab, with a total expected investment of over $4 billion, is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. It is projected to grow into a key HBM production hub in the US led by a workforce of approximately 1,000 personnel during anticipated commercial operations.
Notably, the Indiana fab marks SK hynix’s first HBM production base established in the United States, featuring an operation framework closely integrated with production in South Korea. Cutting edge wafers produced by SK hynix in Korea will be delivered to Indiana, where they will undergo advanced packaging and testing before Made in USA products are supplied to US customers.
Furthermore, an “Advanced Packaging R&D Testbed” will be built alongside the production lines, enabling customers, universities, and business partners to collaboratively develop next-generation packaging technologies and rapidly execute prototype fabrication and performance validation.
As competition to expand AI infrastructure intensifies, the Indiana fab, which connects
SK hynix’s Korea-US HBM production, is expected not only to help stabilize the U.S. semiconductor supply chain but also to contribute to strengthening the national economy and security in the AI era.
“SK hynix’s historic investment in West Lafayette is further proof that Indiana is leading the way in rebuilding America’s semiconductor industry,” said Senator Young. “This project will create good-paying jobs, strengthen our national and economic security, and ensure the technologies of the future are developed and manufactured here in the United States. I was proud to help make this investment possible through the CHIPS and Science Act, and I look forward to seeing the impact it will have on Hoosiers and our country for decades to come.”
Indiana Governor Mike Braun remarked, “This project will usher in the next generation of American innovation, bring thousands of good-paying jobs to Indiana and supercharge regional economic development. It’s a win for Hoosiers, a win for our economy and a great leap forward for Indiana in the race to be the best in the industries of the future.”
Strengthening the Local Ecosystem and Bilateral Economic Cooperation with Local and National Companies
SK hynix’s investment in Indiana is expected to foster a virtuous cycle of strengthening the US semiconductor ecosystem and enhancing economic cooperation between South Korea and the United States.
Currently, more than 100 companies are being considered as suppliers for materials, components, and equipment for the West Lafayette facility, which will support the stable operation of the Indiana fab and further solidify the US AI ecosystem. SK hynix also plans to create approximately 7,000 direct and indirect jobs with local and national companies during construction of the advanced packaging facility and subsequent commercial operations.
Kang Kyung-wha, South Korean Ambassador to the US, stated, “SK hynix’s investment in Indiana is not merely an investment in semiconductor manufacturing facilities, but the establishment of the first AI memory production facility and R&D center in the United States, creating a unique model for nurturing semiconductor talent and strengthening collaboration with the government and external organizations.”
MOU for R&D Collaboration with Purdue University and Veteran Recruitment Program
At the groundbreaking ceremony, SK hynix also signed a Memorandum of Understanding(MOU) with Purdue University for research and development collaboration in the field of advanced packaging.
Through the MOU, both parties will strengthen R&D cooperation and will jointly research system integration and advanced packaging technologies, including HBM. In addition,
SK hynix plans to expand efforts on cultivating and recruiting world-class talent from across the Midwest.
During the event, a recruitment partnership was also established to honor the special historical connection with Indiana, which deployed approximately 140,000 troops during the Korean War. SK Group agreed to provide new employment and career opportunities for discharged USFK service members. To this end, SK Group will participate as a hiring corporation in the ‘USFK Veterans Job Platform’ operated by the Korea Chamber of Commerce and Industry(KCCI) and the Korea-US Alliance Foundation, thereby contributing to the robust partnership between the two nations.
Kwak Noh-Jung, CEO of SK hynix, declared, “Today marks the day when the United States and SK hynix embark on a new future of AI together.” He added, “The United States is the epicenter of AI innovation, bringing together premier customers, top-tier R&D capabilities, and partners and Indiana fab will become a gateway to deliver first Made in USA HBM proudcts.” He emphasized, “We will expand our investments and collaboration in the US, grow together, and become the most trusted partner in shaping the future of AI in America.”
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About SK hynix Inc.
SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips(“DRAM”) and flash memory chips(“NAND flash”) for a wide range of distinguished customers globally. The Company’s common shares are traded on the Korea Exchange, its American Depositary Shares are traded on NASDAQ, and its Global Depository Shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
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