TSMC's yield issues in advanced HBM packaging, affecting InFO and CoWoS processes, threaten AI accelerator supply and expose risks of over-reliance on Taiwan, creating an opportunity for Intel Foundry…
SK hynix is collaborating with TSMC and Intel Foundry to integrate its HBM4 memory into advanced packaging technologies, including Intel's EMIB, as disclosed at Hot Chips 2026. The collaboration aims …
Intel's EMIB packaging technology is gaining traction as TSMC's CoWoS advanced packaging lines are booked through 2027, with Google committing to order more than 3 million units of Intel's EMIB-T for …
Sandisk and SK Hynix are developing high-bandwidth flash (HBF) memory technology that could boost GPU accelerator memory capacity from hundreds of gigabytes to terabytes by stacking NAND flash layers,…
TSMC is developing an EMIB-like advanced packaging technology to compete with Intel's Embedded Multi-die Interconnect Bridge, according to sources close to The Information. The company's existing CoWo…
TSMC is developing a new chip packaging technology called CoPoS (Chip-on-Panel-on-Substrate) that replaces traditional circular 300mm wafers with rectangular 310×310 mm panels to increase usable surfa…
Intel Foundry is scaling advanced chip packaging at its Rio Rancho, New Mexico facilities to enable next-generation AI semiconductors, expanding packages to 8x the industry standard today and over 12x…
TSMC Deputy Co-COO Kevin Zhang stated the company is not concerned about Intel's packaging technology competition during TSMC's North America Technology Symposium on April 22, 2026. Zhang acknowledged…
MediaTek has integrated Intel's EMIB chip packaging technology alongside TSMC's CoWoS and SoIC services for its AI chip designs, making it one of the few semiconductor designers to dual-source advance…