STMicroelectronics is ramping its PIC100 silicon photonics platform on 300-mm wafers to address the growing demand for optical interconnects in AI data centers, where copper links are reaching limits …
GlobalFoundries Vice President Sudipto Bose said at the MIPS 'Physical AI is Agentic AI at the Edge' event in Taipei that the company's portfolio, including silicon photonics, RF-GaN, power GaN, and a…
At imec's ITF World 2026 conference in Antwerp, the semiconductor industry signaled a shift from transistor scaling to systems-level integration, driven by AI's demands on memory, interconnects, and p…
Researchers at Leti Innovation Days 2026 identified energy consumption as the primary constraint on AI hardware scaling, with data movement accounting for about 40% of energy use in large language mod…
As AI shifts from training to inference, optical interconnects are moving closer to chips to address bandwidth, latency, and energy bottlenecks. Imec researchers argue that co-packaged optics will be …
Ambarella is using AI agents to abstract its software development kit, enabling independent software vendors to port applications to its hardware in days instead of months. The company has onboarded I…
The OpenSearch Foundation positions OpenSearch as an open data infrastructure layer for AI applications, search, observability, and security monitoring, as agentic workloads scale. Executive director …
The semiconductor industry is shifting from traditional chip scaling to heterogeneous large-scale integration (HLSI) to meet AI demands, according to imec. This new approach combines specialized techn…
The Model Context Protocol (MCP), introduced by Anthropic and now governed under the Linux Foundation's Agentic AI Foundation, has emerged as a common framework for connecting AI models to external to…
EE Times moderated a panel on RISC-V ecosystem growth for Physical AI with Arteris, GlobalFoundries, and Tenstorrent at a Taipei event, discussing scalable robots, computing power balance, and the imp…
Tenstorrent CEO Jim Keller claims his company's BlackHole Galaxy servers can outperform both GPUs and specialized AI hardware, including Nvidia and Cerebras, by solving AI inference as a networking an…
CEA-Leti CEO Sébastien Dauvé told EE Times that AI's primary bottleneck is architectural, not just energy, as the industry must integrate memory, photonics, communications, and sensing into complex sy…
EE Times moderated a panel with MIPS CEO Sameer Wasson and RISC-V International CEO Andrea Gallo on rethinking chip design for agentic AI. The discussion covered GlobalFoundries' acquisition of MIPS a…
Wireless connectivity, not artificial intelligence, is the primary bottleneck limiting the deployment of autonomous systems such as drones and robots in real-world environments, according to an analys…
The UK Semiconductor Centre (UKSC) signed a memorandum of understanding with Rapidus Corporation to give British innovators access to 2-nm chip technology by 2027, announced as UK and Japanese prime m…
At Computex, Delos Data demonstrated a modular server chassis designed to help AI chip startups deploy rack-scale systems more quickly. The front of the system contains 36 OSFP cages rated at 1.6 Tbps…
South Korean AI silicon startup Rebellions is prioritizing memory-centric architecture in its technology roadmap, leveraging strategic ties with SK Hynix and Samsung Foundry as it explores IPO options…
PALO ALTO, Calif. — Startup Ricursive, founded by the former leads of Google's AlphaChip project, announced plans to develop an end-to-end AI model for chip design, aiming to transform the industry by…
Efinix has launched the Titanium Edge family of FPGAs for edge AI applications, based on soft or hard RISC-V cores with AI instruction extensions. The company's XLR logic cell dynamically reconfigures…
Computex 2026 in Taipei shifted its focus from AI PCs to agentic AI, with Nvidia CEO Jensen Huang declaring during his opening keynote that "agentic AI and useful AI have arrived." Nvidia unveiled its…