ChangXin Memory Technologies (CXMT) announced on August 29, 2026 that it has begun mass production of LPDDR6 memory, the first commercial deployment of the standard, beating Samsung and SK Hynix. The …
Samsung Electronics presented its LPDDR5X-PIM processing-in-memory solution at Hot Chips 2026, claiming it is the world's first LPDDR-based PIM product for AI inference. The chip delivers 614 GB/s PIM…
Micron's new 256GB SOCAMM, built on its 1-gamma DRAM process, targets AI inference workloads by offering three times the power efficiency of standard DDR5 RDIMMs, according to Praveen Vaidyanathan, VP…
Kioxia Corporation announced UFS 5.0 embedded flash memory solutions for AI-enabled mobile and edge devices, with commercial samples available in 1 TB and 512 GB capacities and mass production expecte…
Intel announced that its Xeon 6 family will receive a mid-generation upgrade with support for faster memory, starting with DDR5-8000 RDIMMs for select Xeon 6 6700P SKUs in August 2025, and second-gene…
JEDEC is updating its LPDDR6 memory standard to include features tailored for AI data centers, including a narrower x6 per-die interface to double memory densities and a new SOCAMM2 module standard. T…