IBM detailed its dual-ISA processor strategy at Hot Chips 2026, integrating AI-specific instructions into the mainframe's core pipeline to reduce data movement and keep security intact. The approach c…
AMD detailed the system architecture of its MI400 series Instinct accelerators at Hot Chips 2026, centering on the Helios rack-scale platform built from the 96-core EPYC Venice CPU, Instinct MI455X GP…
AMD detailed the Instinct MI400 series GPU architecture at Hot Chips 2026, highlighting the MI455X silicon with 432 GB of HBM4 memory, 23.3 TB/s bandwidth, and a peak MXFP4 performance of 40.26 petafl…
NVIDIA Corp. detailed its Rubin GPU and Vera Rubin NVL72 rack at Hot Chips 2026, targeting agentic AI workloads with a full-stack platform spanning seven chips and five racks. The company claims up to…
Fujitsu detailed its next-generation Monaka data center CPU at Hot Chips 2026, positioning the Arm-based chip as an energy-efficient solution for AI workloads. The chiplet-based processor, built on TS…
NVIDIA unveiled its Vera CPU at Hot Chips 2026, an 88-core Arm-based server processor built on the new Olympus core architecture, designed to power its upcoming Vera Rubin AI systems. The chip feature…
IBM detailed its future IBM Z and LinuxONE dual-ISA processor and second-generation AI inference accelerator at Hot Chips 2026, with the chip carrying 11 IBM Z cores at 5.7+ GHz on a 2nm process, each…
D-Matrix unveiled Raptor, a datacenter inference accelerator that bonds 3D DRAM directly to the logic die, eliminating the memory PHY, at Hot Chips 2026. The card delivers 32GB of capacity at over 100…
IBM Corp. announced at the Hot Chips 2026 conference that it is developing a dual-architecture processor with Arm Holdings Ltd. that will run both z/OS and Arm-native Linux workloads on the same core,…
Samsung Electronics and SK Hynix are pursuing divergent HBM4 designs, with Samsung introducing an active base die using 4nm logic processes while SK Hynix focuses on packaging and heat management, for…
SK hynix detailed its advanced packaging roadmap for High-Bandwidth Memory (HBM) at Hot Chips 2026, focusing on HBM4 and beyond, with plans to double TSV counts, increase I/O speeds, and integrate log…
Samsung confirmed at the Hot Chips 2026 conference that its HBM4E memory will reach 16 Gbps per pin, up from the 14 Gbps currently shipping since late May. At 16 Gbps, a single HBM4E stack will delive…
At Hot Chips 2026, Anurag Agarwal and Radhakrishna Giduthuri presented simulations and projections for High Bandwidth Flash (HBF), a new memory technology that combines SSD-like flash storage with HBM…
D-Matrix presented its Raptor 3D-DRAM accelerator for generative inference at Hot Chips 2026, claiming it addresses the bandwidth and capacity limits of SRAM and HBM by stacking compute directly on DR…
Micron Technology at Hot Chips 2026 detailed how high-bandwidth memory (HBM) and advanced packaging are central to AI system design, citing a widening gap where AI accelerator TFLOPS grow 3x every two…
Semiconductor analyst firm Silicon Codesign published Part 1 of a system-level overview of scale-up AI infrastructure racks, focused on network architecture, ahead of the Hot Interconnects 2026 and Ho…