Physical AI requires a systems architecture approach rather than simply scaling up models, according to a sponsored analysis in EE Times. The shift from cloud-based AI to edge computing demands closed…
CEA-Leti, Scintil Photonics, and NcodiN are developing photonic interconnects that move optical links inside AI processor packages, from co-packaged optics to nanolasers for photonic interposers. Scin…
Microchip has agreed to acquire Israeli edge AI chip startup Hailo, marking the first acquisition since CEO Steve Sanghi returned to lead the company. Hailo, founded in 2017, has raised $344 million a…
A new white paper details how to build a 100Gbps server-grade automated optical inspection (AOI) platform for next-generation semiconductor inspection, addressing bandwidth, scalability, thermal, and …
Vibe coding, the use of LLM-based coding assistants to generate source code from natural language, offers rapid prototyping and increased developer throughput but poses fundamental challenges for safe…
AMD CEO Lisa Su announced new data center GPUs and CPUs at the Advancing AI conference, including the Helios 72-GPU rack system with MI455 GPUs delivering up to 18× more tokens per dollar versus MI355…
Healthcare AI scaling faces structural barriers including data fragmentation, regulatory overhead, legacy infrastructure, and workflow gaps, according to a systems architecture analysis by an industry…
The DAC 2026 Engineering Track will feature ~90 peer-reviewed presentations from engineers designing AI accelerators, memory systems, and interconnects, with keynotes from Qualcomm EVP and CTO Baaziz …
The U.S. government on July 21st announced more than $5 billion in funding for the first projects under the national Genesis Mission to accelerate AI, but analyst Handel Jones of International Busines…
Siemens EDA's Fuse EDA AI system, discussed by Niranjan Sitapure, Jeff Dyck, and Ryan Silk, automates EDA tasks that once took hours into seconds, boosting productivity across the entire workflow by c…
AI chip startup Etched has raised $300 million in a Series C round at a $10 billion pre-money valuation, bringing total funding to $1.1 billion, with $1 billion in pre-orders already secured. The roun…
Samsung Electronics engineers will present a reinforcement-learning agent that tunes SoC quality-of-service settings at the DAC 2026 Engineering Track, demonstrating that major semiconductor houses ar…
The AI transformation of chip design is now visible on the exhibit floor at the 63rd Design Automation Conference (DAC) in Long Beach, according to program chair and Synopsys employee Simon Davidmann.…
CEA-Leti is rethinking the memory roadmap as AI reshapes computing, with François Andrieu, head of the memory lab, saying the institute sees new memories filling gaps rather than replacing SRAM, DRAM,…
SK Hynix completed the largest U.S. share sale by a foreign company in history, raising $26.5 billion as its American depositary receipts began trading on Nasdaq, with shares surging 13% on the first …
Quantum processing units (QPUs) are moving from physics experiments to data center infrastructure, with organizations like the Open Compute Project and the U.K.'s Quantum Data Centre of the Future pro…
Edge AI workloads, particularly reasoning models and agentic systems, fail when memory capacity is exhausted, a problem traditional architectures cannot solve, according to a technical analysis by EE …
QuickLogic and PQSecure have integrated post-quantum cryptography (PQC) into system-on-chip (SoC) designs using embedded FPGA (eFPGA) hard IP, enabling field-updatable cryptographic engines. The colla…
RISC-V International CEO Andrea Gallo declared at the RISC-V Summit Europe 2026 in Bologna that the open-standard instruction set architecture is now targeting data centers, edge AI, and space explora…
ASML reported Q2 2026 net sales of €9.3 billion and net income of €2.9 billion, exceeding its own guidance, and raised its full-year outlook. The company plans to increase capacity for Low-NA EUV and …