Japan's Ministry of Defense has requested a record ¥8.89 trillion ($60 billion) budget for fiscal year 2027 to integrate AI into Self-Defense Forces command systems and expedite attack drone acquisiti…
Sony Music Publishing and Warner Chappell Music, along with other music publishers, filed a lawsuit against Anthropic, CEO Dario Amodei, and co-founder Benjamin Mann in a California federal court, all…
TSMC's Dr. Ming-Fa Chen presented updates on the COUPE silicon photonics platform at SEMICON Taiwan 2026, detailing plans to integrate modulators, light sources, and Semiconductor Optical Amplifiers (…
Lam Research has begun construction on a new R&D center in Oregon to develop advanced processes for high-bandwidth memory (HBM) and other AI-specific chip components, aiming to speed up supply for Sam…
SK hynix plans to start mass production of advanced packaging at its new US plant in Indiana by 2029, marking its first advanced packaging site in the US. The facility aims to support the local AI eco…
A QbitAI analysis found that 734 dependency packages can degrade the performance of locally deployed AI models, revealing a bottleneck in China's AI inference stack that affects reliability and predic…
The U.S. Commerce Department proposed new export controls to block remote access to advanced AI chips in China, targeting the compute-as-a-service loophole. This shifts U.S.-China tech competition fro…
Rapidus President Atsuyoshi Koike said strong demand for AI semiconductors and data centers is a 'powerful tailwind' for the company's planned 2nm chip mass production, which is on schedule. Koike pro…
SK hynix is building a packaging plant in Indiana with mass production targeted for 2029, while keeping core HBM manufacturing in Korea, a move that responds to CHIPS Act incentives and strengthens US…
The memory market is projected to grow nearly four-fold to over $837 billion by 2026, driven by AI demand for high-bandwidth memory (HBM), according to a Gartner forecast cited in EE Times Japan. Japa…
Arm unveiled its AGI CPU architecture at Hot Chips 2026, targeting AI agent workloads such as tool calling and workflow orchestration. Based on the Neoverse V3 core and manufactured on TSMC's 3nm proc…
Nvidia's credit default swaps hit a record high as the bond market reacts to its approximately $750 billion in AI commitments, including $500 billion in customer financing and a $105 billion guarantee…
TSMC's yield issues in advanced HBM packaging, affecting InFO and CoWoS processes, threaten AI accelerator supply and expose risks of over-reliance on Taiwan, creating an opportunity for Intel Foundry…
YMTC, China's largest NAND flash manufacturer and the third-largest global supplier by shipments, is preparing an IPO on the Shanghai STAR market to fund its pivot to high-value AI enterprise SSDs. Th…
Tom Kellermann, VP of Security and Threat Research at TrendAI (Trend Micro), warned that the traditional linear 'cyber kill chain' defense is no longer effective against AI-driven attacks, as attacker…
Japan's government has unveiled an "AI Robotics Strategy" aiming to position the country as a leading "third pole" in AI robotics alongside the US and China, targeting the domestic deployment of 10 mi…
Samsung Electronics and SK Hynix are pursuing divergent HBM4 designs, with Samsung introducing an active base die using 4nm logic processes while SK Hynix focuses on packaging and heat management, for…
TSMC's global power consumption is projected to reach 28.77 billion kWh in 2025, a 12.6% increase from 2024, representing about 10.2% of Taiwan's total electricity use, according to the company's late…
SK hynix detailed its advanced packaging roadmap for High-Bandwidth Memory (HBM) at Hot Chips 2026, focusing on HBM4 and beyond, with plans to double TSV counts, increase I/O speeds, and integrate log…
Zhongcheng Hualong (中诚华隆) launched its HL200 AI inference chip and a 'supernode' intelligent computing cluster in Beijing, scaling to 10,240 cards, marking a shift to system-level coordination for dom…