TrendForce estimates global data center electricity demand will reach 161GW by 2026, a 31% annual increase driven primarily by AI servers, with AI servers' share of that demand rising from 25% in 2025…
Google released Gemini 3.8 Live, an "Extended Thinking" version of its conversational AI that can run background tasks such as drafting emails, retrieving data, and scheduling meetings during a conver…
Elon Musk, CEO of SpaceXAI, said on X that training for Grok 4.8 will complete this week, Grok 4.9 will be 'Astra/Fable class,' and Grok 5 will achieve AGI, while simultaneously endorsing Anthropic CE…
MediaTek announced its Dimensity 9600 Pro and 9600 M flagship 5G Agentic AI chips on September 15, 2026, with the 9600 Pro built on TSMC's 2nm process and delivering a 51% boost in large language mode…
Murata Manufacturing, the world's largest producer of Multi-Layer Ceramic Capacitors (MLCCs), plans to mass-produce its Integrated Package Solution (iPaS) next year, integrating passive components suc…
Chinese AI startup DeepSeek released its DeepSeek V4.1 Flash model on September 13, 2026, the smallest in its new series, featuring native multimodal visual understanding. The 552B parameter Mixture-o…
OpenAI's GPT-6 Astra solved the final remaining problem in the elite FrontierMath Tier 4 benchmark, taking the model from a sub-2% success rate to total saturation in under two years. In response, twe…
TSMC plans to double its CoWoS advanced packaging capacity to 260,000 wafers per month by 2028, up from an estimated 130,000 by the end of 2026, according to 科技新報 TechNews. The current CoWoS bottlenec…
Arm introduced three new solutions at its 'Arm Everywhere China' event in Shanghai: Arm CSS for Mobile 2, Arm Neoverse CSS N4 for AI infrastructure, and an expansion of its 'Arm Total Design' service …
ASML has revealed a Hyper-NA EUV roadmap extending beyond 2030, a plan Japanese press including EE Times Japan views as the de facto industry standard that will test Japan's semiconductor supply chain…
SanDisk demonstrated at recent industry events that systems equipped with its High Bandwidth Flash (HBF) memory can match the AI inference performance of High Bandwidth Memory (HBM) systems while usin…
Siemens announced at its EDA Tech Forum in Tokyo that it is integrating NVIDIA AI into its Fuse EDA software to support Japan's Rapidus 2nm chip production, aiming to automate verification tasks and a…
Winbond VP Chen Shao-kun said at SEMICON Taiwan 2026 that AI demand is not a bubble but a supply chain capacity bottleneck, citing continued capital expenditure by wafer fabs, advanced packaging, test…
Chinese robotics company Astribot released a video demonstrating its new 'SmoothRL' technology, a reinforcement learning method that enables robots to learn from their actions in real-world environmen…
Kioxia Corporation is developing CXL memory modules using its XL-FLASH technology to replace costly DRAM in AI systems, aiming to lower data center costs and address supply chain limits. The company s…
Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging and co-packaged optics (CPO), highlighting its 12…
Sony's CMOS image sensor market share has reached approximately 50% globally, according to a Yole Group survey, matching Sony's internal projections and making the company a single chokepoint in the s…
Japan's Ministry of Defense has submitted a record-high budget request of ¥8.89 trillion (approximately $57 billion USD) for fiscal year 2027, focusing on modernizing its defense capabilities. Key ini…
TSMC Senior VP Jeffrey Hou said at SEMICON Taiwan 2026 that AI demand nearly doubled equipment procurement forecasts within six months, prompting TSMC to build 13 fabs in Taiwan and 5-6 overseas simul…
Amin Vahdat, Google's Senior VP for AI & Infrastructure, announced at SEMICON Taiwan 2026 a 60% expansion of Google's AI infrastructure R&D center in Shilin, Taipei, which opened in late 2025, to enha…