Meta is testing robots that can plug in cables and reset servers at data centres, sparking concerns among workers that they will soon be replaced. Whistleblowers told Wired the social media giant is w…
Solid-state transformers (SSTs) are emerging as a key technology for next-generation AI data centers, converting medium-voltage AC directly to 800 V DC to improve efficiency and reduce equipment footp…
Meta introduced MetaRoCE, a clean-sheet RDMA transport protocol for AI workloads on commodity Ethernet, which treats the fabric as lossy and pushes ordering, path selection, and recovery into the NIC.…
Meta has developed MetaRoCE, a custom RDMA transport protocol that sprays packets out of order to boost AI throughput on Ethernet-based scale-out networks, maintaining around 86% throughput at 1% pack…
Meta has released MetaRoCE, a new RDMA transport protocol designed for AI workloads on commodity Ethernet, through the Open Compute Project (OCP), including a specification, reference software impleme…
Credo, a San Jose, California-based vendor, formed the Lightweight Serial Interconnect (LSI) Workstream within the Open Compute Project (OCP) to develop open standards for chiplet interconnects, aimin…
Fluid-side observability is emerging as a critical factor in AI hardware reliability as direct liquid cooling becomes standard, according to a sponsored article on EE Times. The article argues that mo…
NVIDIA has moved its 800-VDC power architecture from concept to production, with the first MGX-compatible 800-VDC power rack scheduled for Q3 2026, delivering high-voltage DC to AI compute racks while…
Lightmatter and 18 other companies launched the Open Silicon Photonics for AI Systems initiative as an official workstream within the Open Compute Project, publishing a 300-page white paper to standar…
Lightmatter has formally launched the Open Silicon Photonics for AI Systems initiative, an Open Compute Project workstream backed by Celestica, Dell, Keysight, and Qualcomm, to define open co-packaged…
Google, Microsoft, and Nvidia are collaborating through the Open Compute Project (OCP) to establish 800-volt direct current (800VDC) as an open standard for powering high-density AI data centers, aimi…
SanDisk's High Bandwidth Flash technology delivered 12.8 TB/s of memory bandwidth with 4 TB of capacity per GPU in simulation, closing to within 2.2% of HBM bandwidth for inference workloads. The stac…
SanDisk and SK hynix introduced High Bandwidth Flash (HBF), a new memory standard combining NAND flash with wafer bonding to deliver HBM-level read bandwidth at 8 to 16 times the capacity, targeting A…
NVIDIA, Google, and Microsoft, through the Open Compute Project, have published specifications for an 800 VDC power architecture to address the power distribution bottleneck in AI data centers, with m…
Sandisk and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project, defining NAND-based memory stacks up to 512GB with performance up to 3.0TB/…
Sandisk and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project on August 3-4, defining an open framework for NAND-based near-compute memory…
Sandisk and SK hynix have published the first open technical specification for High Bandwidth Flash (HBF) through the Open Compute Project, creating a new memory tier between High Bandwidth Memory and…
Enphase Energy announced its IQ Solid-State Transformer (IQ SST) platform for AI data center power infrastructure, targeting an 11 GW annual US market by 2031. The modular system starts at 1.25 MW, sc…
SK Hynix and Sandisk unveiled the first standard specifications for high bandwidth flash (HBF), a next-generation memory technology designed to address supply chain constraints of high bandwidth memor…
SK hynix and Sandisk released the first industry standard for high bandwidth flash (HBF), defining products with capacities up to 512 gigabytes and bandwidth from 0.4 to 3 terabytes per second, aiming…