South Korean memory chipmaker SK hynix announced a 1,100 trillion won ($713 billion) investment plan to expand domestic manufacturing capacity, including new fabs for NAND and HBM, and will list on th…
Nvidia canceled a planned quad-die version of its Rubin Ultra AI accelerator, shifting to a dual-die design due to manufacturing execution concerns. The change moves from highly integrated CoWoS-L pac…
Samsung Electronics shares surged up to 6.51% on June 1 after reports it began shipping samples of its next-generation HBM4E high-bandwidth memory chips to global customers, driven by strong AI demand…
SK hynix has begun sampling its 12-layer HBM4E memory, positioning the company to maintain its lead in the AI memory upgrade cycle. The new high-bandwidth memory targets next-generation AI accelerator…
Samsung Electronics reviewed strategies to expand sales of high-bandwidth memory (HBM) chips and discussed long-term supply agreements with major customers at a global strategy meeting, amid surging d…
SK hynix shipped samples of its 12-layer HBM4E memory to major customers, entering customer qualification about three weeks after rival Samsung Electronics. The device offers 48GB capacity, 16Gbps per…
SK hynix has shipped samples of its 12-layer HBM4E memory to major customers, entering the customer-qualification stage weeks after rival Samsung Electronics claimed the industry's first such shipment…
Samsung Electronics began shipping samples of its 12-layer HBM4E high-bandwidth memory chips on May 29, beating its own second-half 2026 target and achieving speeds of 16 Gbps per pin. The company’s s…
Samsung Electronics has begun shipping samples of its next-generation HBM4E high-bandwidth memory chip to global customers, marking an "industry first" for the 12-layer design. The chip offers speeds …