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HBM4E

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// recent coverage 25 mentions

05:30
2026-08-24
techpowerup.com
ai-infrastructure

Samsung Confirms HBM4E Memory Running at 16 Gbps Per Pin

Samsung confirmed at the Hot Chips 2026 conference that its HBM4E memory will reach 16 Gbps per pin, up from the 14 Gbps currently shipping since late May. At 16 Gbps, a single HBM4E stack will delive…

10:43
2026-08-22
mlq.ai
artificial-intelligence

Micron CEO says AI is changing memory’s boom-and-bust cycle

Micron CEO Sanjay Mehrotra said artificial intelligence has changed the memory industry's traditional boom-and-bust cycle by creating sustained demand for high-bandwidth memory and other data-center p…

14:05
2026-07-31
blocksandfiles.com
artificial-intelligence

For Samsung, HBM is the gift that keeps on giving

Samsung Electronics reported record quarterly revenue of ₩171.5 trillion ($118.7 billion) and operating profit of ₩89.5 trillion ($62 billion) for Q2 2026, up 130% and 1,812.4% year-over-year respecti…

03:45
2026-07-31
letsdatascience.com
ai-infrastructure

Samsung and SK Hynix Post Record AI-Memory Profits

Samsung Electronics and SK Hynix posted a combined 150 trillion won in operating profit for the quarter ended June 30, with Samsung reporting 89.5 trillion won and SK Hynix 60.5 trillion won, both rec…

23:45
2026-07-28
letsdatascience.com
artificial-intelligence

SK hynix Reports Record 60.5 Trillion Won Q2 Operating Profit

SK hynix reported preliminary second-quarter revenue of 79.3 trillion won and operating profit of 60.5 trillion won on July 29, both quarterly records, with a 76% operating margin. The memory maker at…

13:57
2026-07-03
eetimes.com
ai-infrastructure

SK hynix Plans $713B Domestic Investment

South Korean memory chipmaker SK hynix announced a 1,100 trillion won ($713 billion) investment plan to expand domestic manufacturing capacity, including new fabs for NAND and HBM, and will list on th…

12:45
2026-06-30
letsdatascience.com
ai-chips

Nvidia drops quad-die Rubin Ultra for dual-die

Nvidia canceled a planned quad-die version of its Rubin Ultra AI accelerator, shifting to a dual-die design due to manufacturing execution concerns. The change moves from highly integrated CoWoS-L pac…

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