CoPoS

TSMC is developing a new chip packaging technology called CoPoS (Chip-on-Panel-on-Substrate) that replaces traditional circular 300mm wafers with rectangular 310×310 mm panels to increase usable surfa…

At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president, stated that wafer-level packaging technologies like CoWoS currently offer superior interconnection density for the l…