Microchip Technology (Nasdaq: MCHP) demonstrated an end-to-end PCIe Gen 6 storage architecture combining its Switchtec PCIe Gen 6 switches with Micron 9650 NVMe SSDs at the 2026 Future of Memory and S…
NVM Express, Inc. released all 11 NVMe specifications, including the NVMe 2.4 Base Specification, with new features and engineering change notices (ECNs) enhancing security, manageability, and sustain…
According to DigiTimes, the entire memory production capacity for 2027 has been fully booked by Samsung, SK hynix, and Micron, leaving no room for additional DRAM wafer purchases. Only 60-70% of estim…
GIGABYTE launched the AORUS P1600W 80+ Titanium Modular PCIe 5.1 AI TOP, a 1600 W power supply with 80 Plus Titanium efficiency in a compact 160 mm chassis, designed for enthusiast PC builds and local…
Sandisk Corporation and SK hynix Inc. released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project (OCP), six months after the consortium began work in Februa…
Lenovo's upcoming Googlebook 15 laptop has been revealed in leaked renders, showing a 15-inch device with a sandblasted aluminium casing, a dedicated Google key, and ports including HDMI, USB-C, and a…
KIOXIA America, Inc. announced the KIOXIA GP1 Series PCIe 6.0 NVMe SSD, the first product in its GP Series of Super High IOPS SSDs optimized for GPU direct access, delivering up to 10 million random r…
TCL, a leading consumer electronics brand, announced the U.S. availability of the TCL TAB A1 Plus NXTPAPER, a 12.2-inch 2.4K resolution tablet featuring AI-powered productivity tools and the company's…
Kioxia Corporation will showcase its KIOXIA XL1 series, a Compute Express Link (CXL) compatible memory expansion module designed for AI workloads, at FMS: the Future of Memory and Storage from August …
Microsoft Visual Studio Professional 2026 is available for a one-time $29.97 lifetime license, down from $499.99, until August 9 at 11:59 p.m., offering a traditional IDE with AI-assisted coding via I…
Montage Technology announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, which supports 8000 MT/s DDR5 memory and PCIe 6.x with data transfer rates up t…
XCENA introduced MX1, a production memory lineup designed to address capacity, utilization, and data-movement bottlenecks in AI inference, and is showcasing it at FMS 2026. The CXL-based MX1 aims to s…
Apple reported fiscal 2026 third-quarter revenue of $109.4 billion, up 16 percent year over year, with diluted earnings per share of $2.02, up 29 percent, including a favorable impact of $0.11 from ta…
NVIDIA RTX 50-series GPUs could see a 20-30% price hike in 2026, marking the third price increase for the company that year, according to a report by Taiwanese publication Economic Daily Times. The pr…
TSMC is developing an EMIB-like advanced packaging technology to compete with Intel's Embedded Multi-die Interconnect Bridge, according to sources close to The Information. The company's existing CoWo…
TSMC's 1.4 nm fab for its A14 node is set for completion by April 2027, according to Taiwan's Commercial Times. The company is using artificial intelligence and virtual reality to accelerate construct…
Renesas Electronics Corporation announced its third-generation DDR5 MRDIMM chipset solutions, delivering speeds up to 16,000 MT/s for AI data centers and cloud infrastructure. The new MRCD (RRG5013) a…
Innodisk, a global AI solution provider, introduced the DDR5 12800 MT/s MRDIMM, an advanced memory module that delivers 60% higher bandwidth than traditional DDR5 8000 MT/s RDIMMs, supporting generati…
TrendForce forecasts that AI will remain the primary driver of memory demand in 2027, but DRAM and NAND Flash markets will diverge: DRAM supply will stay tight with rising prices due to HBM allocation…
Kioxia Corporation announced it has commenced sample shipments of 1 Tb TLC memory devices using its 9th-generation BiCS FLASH 3D flash memory technology, targeting AI-enabled PCs and smartphones requi…