AI chip startup Etched has raised $300 million in a Series C round at a $10 billion pre-money valuation, bringing total funding to $1.1 billion, with $1 billion in pre-orders already secured. The roun…
Samsung Electronics engineers will present a reinforcement-learning agent that tunes SoC quality-of-service settings at the DAC 2026 Engineering Track, demonstrating that major semiconductor houses ar…
The AI transformation of chip design is now visible on the exhibit floor at the 63rd Design Automation Conference (DAC) in Long Beach, according to program chair and Synopsys employee Simon Davidmann.…
CEA-Leti is rethinking the memory roadmap as AI reshapes computing, with François Andrieu, head of the memory lab, saying the institute sees new memories filling gaps rather than replacing SRAM, DRAM,…
SK Hynix completed the largest U.S. share sale by a foreign company in history, raising $26.5 billion as its American depositary receipts began trading on Nasdaq, with shares surging 13% on the first …
Quantum processing units (QPUs) are moving from physics experiments to data center infrastructure, with organizations like the Open Compute Project and the U.K.'s Quantum Data Centre of the Future pro…
Edge AI workloads, particularly reasoning models and agentic systems, fail when memory capacity is exhausted, a problem traditional architectures cannot solve, according to a technical analysis by EE …
QuickLogic and PQSecure have integrated post-quantum cryptography (PQC) into system-on-chip (SoC) designs using embedded FPGA (eFPGA) hard IP, enabling field-updatable cryptographic engines. The colla…
RISC-V International CEO Andrea Gallo declared at the RISC-V Summit Europe 2026 in Bologna that the open-standard instruction set architecture is now targeting data centers, edge AI, and space explora…
ASML reported Q2 2026 net sales of €9.3 billion and net income of €2.9 billion, exceeding its own guidance, and raised its full-year outlook. The company plans to increase capacity for Low-NA EUV and …
TSMC raised its 2026 capital budget to as much as $64 billion and pledged an additional $100 billion in U.S. investment, adding to a $165 billion Arizona project, to meet surging AI demand from custom…
STMicroelectronics is ramping its PIC100 silicon photonics platform on 300-mm wafers to address the growing demand for optical interconnects in AI data centers, where copper links are reaching limits …
Nidec Drive Technology is developing specialized gearing systems for humanoid and mobile robots, including FLEXWAVE strain-wave reducers, KINEX cycloidal gearboxes, and high-precision planetary system…
TYL Semi has raised $43 million in seed funding to launch a fabless chiplet business model that de-risks AI infrastructure builders' large chiplet-based designs by handling surrounding chiplets, packa…
New Ideas Industrial Co., Limited, a Shenzhen-based semiconductor distributor founded in 2012, offers full-chain supply chain services for AI computing, high-end storage, industrial UAVs, and new-ener…
GlobalFoundries Vice President Sudipto Bose said at the MIPS 'Physical AI is Agentic AI at the Edge' event in Taipei that the company's portfolio, including silicon photonics, RF-GaN, power GaN, and a…
MSI is leveraging its R&D and manufacturing strengths to capture opportunities in the next wave of AI growth, with a product roadmap centered on on-premises AI and hybrid cloud applications over the n…
At imec's ITF World 2026 conference in Antwerp, the semiconductor industry signaled a shift from transistor scaling to systems-level integration, driven by AI's demands on memory, interconnects, and p…
Apple announced a multiyear, $30 billion deal with Broadcom to produce custom silicon and wireless components, part of Apple's $600 billion U.S. investment plan. The agreement will expand Broadcom's F…
Researchers at Leti Innovation Days 2026 identified energy consumption as the primary constraint on AI hardware scaling, with data movement accounting for about 40% of energy use in large language mod…