Researchers at the University of North Carolina at Charlotte, led by associate professor Hamed Tabkhi, are developing an AI system that learns normal human movement patterns to detect anomalies in pub…
Artificial intelligence is increasingly integrated into IoT solutions, with IoT devices forecast to exceed 40 billion by 2034 and the smart buildings market projected to surpass $550 billion by 2033. …
Thermal management will become a critical enabler of agentic AI as workloads shift from short bursts to continuous operation on edge devices, according to an analysis published by EE Times. The articl…
Kioxia presented a Compute Express Link (CXL) module at a Tokyo briefing that uses its XL-Flash NAND to replace some DRAM in AI workloads, claiming it can double memory capacity at the same cost while…
Power delivery for AI processors now depends on the package itself, not just the board, as chiplet architectures and HBM push voltage rails near 1V and current transients faster, according to Power El…
Indian fabless semiconductor startup HrdWyr, founded in 2023 by Ramamurthy Sivakumar and Guruswamy Ganesh, is developing AI-native system-on-chips (SoCs) for power and battery management, aiming to in…
Sir Robin Saxby, founding CEO and chairman of Arm, said in an exclusive video interview at the TechWorks S2S Summit 2026 in West London that today's semiconductor CEOs face a far tougher job navigatin…
Patent filings at the intersection of AI and semiconductors increased 114% over the past five years, outpacing the broader sector's 78% growth, according to a report by IP management provider Anaqua. …
Keysight Technologies introduced Keysight SOS Enterprise, an AI-ready engineering data and IP management platform for semiconductor and electronics companies, enabling centralized management, governan…
SK Hynix's first U.S. high-bandwidth memory (HBM) advanced packaging facility, a $4 billion project in Indiana, will begin commercial production of HBM4E chips in the second half of 2029, aiming to cl…
SUSE is positioning hardware portability as a core element of sovereign AI, allowing enterprises to use Nvidia accelerators today without rebuilding their AI infrastructure if they switch to another s…
Advanced cooling technologies are needed as modern vehicles with electric drivetrains, ADAS, and AI processors generate heat fluxes that challenge traditional cooling architectures, according to an ar…
Google's custom-silicon agreement with Marvell Technology extends beyond its tensor processing units to include AI inference accelerators, storage controllers, network interface controllers, memory-in…
OpenAI revealed first benchmarks for its Jalapeño AI accelerator ASIC, developed with Broadcom and Celestica, showing 1.5 to 1.9× more AI work per watt at peak throughput, 1.7 to 3.6× lower end-to-end…
Qualcomm completed its acquisition of Modular, an AI software company co-founded by compiler pioneer Chris Lattner, to break Nvidia's lock-in by enabling AI models to run across different hardware. Qu…
Connectivity has become a foundational design decision in edge AI systems, alongside compute, sensing, and security, according to an article on Embedded.com. The piece highlights Wi-Fi 7's capabilitie…
The NVM Express consortium released NVMe 2.4, adding post-quantum cryptography support, persistent lockdown settings, voltage monitoring, and idle I/O exit latency limits. Mike Allison, chair of the N…
A sponsored technical article from EE Times outlines a systematic approach to designing reliable 24V DC power paths for industrial machines and edge AI hardware, emphasizing that individual component …
Agentic AI is accelerating 3D IC debugging from days to minutes, addressing a bottleneck where first-silicon success rates are below 15% and debugging consumes roughly half of verification effort. The…
A new eBook from Siemens EDA provides silicon and system architects with a framework for designing chips for physical AI systems, addressing real-time latency, power budgets, and security across the f…