Renesas Electronics has unveiled its Gen 3 DDR5 multiplexed rank dual in-line memory module (MRDIMM) chipset, delivering speeds up to 16,000 MT/s and 25% higher memory bandwidth than its Gen 2, to add…
ChipAgents, a two-year-old startup, announced at DAC in Long Beach, California, that it closed an extended Series A round, adding $60 million to the $50 million raised in February 2026, bringing total…
NXP Semiconductors is in talks to acquire Ambarella, a move that could bolster NXP's automotive and edge AI capabilities. Ambarella, which generates only 22% of its revenue from automotive, brings low…
CEA-Leti program manager Pascal Vivet said 3D stacking and chiplet-based architectures are key to overcoming AI's memory and power density limits, as the institute develops interconnects from 10-micro…
A report from the Brennan Center states that U.S. AI-driven military programs could surpass $75 billion in the coming years, excluding secret programs, as nations like Russia and China invest heavily …
AI is compressing digital work, with 139,156 tech-sector job cuts in the first half of 2026, 83% more than the same period in 2025, and AI cited in over 101,000 cuts across U.S. employers, according t…
Qualcomm acquired AI software infrastructure startup Modular for close to $4 billion, betting on an open, hardware-agnostic software stack that enables AI inference across heterogeneous silicon. Modul…
Nidec Drive Technology showcased its FLEXWAVE and KINEX precision gear reducers at Automate 2026 as complementary solutions for next-generation robotics, including humanoids and collaborative robots. …
IoT Tech Expo Europe returns to the RAI Amsterdam on 19-20 October 2026 as part of TechEx Europe, focusing on Industrial AI, Edge AI, and secure embedded systems. The conference agenda, built around f…
Micron's new 256GB SOCAMM, built on its 1-gamma DRAM process, targets AI inference workloads by offering three times the power efficiency of standard DDR5 RDIMMs, according to Praveen Vaidyanathan, VP…
Physical AI requires a systems architecture approach rather than simply scaling up models, according to a sponsored analysis in EE Times. The shift from cloud-based AI to edge computing demands closed…
CEA-Leti, Scintil Photonics, and NcodiN are developing photonic interconnects that move optical links inside AI processor packages, from co-packaged optics to nanolasers for photonic interposers. Scin…
Microchip has agreed to acquire Israeli edge AI chip startup Hailo, marking the first acquisition since CEO Steve Sanghi returned to lead the company. Hailo, founded in 2017, has raised $344 million a…
A new white paper details how to build a 100Gbps server-grade automated optical inspection (AOI) platform for next-generation semiconductor inspection, addressing bandwidth, scalability, thermal, and …
Vibe coding, the use of LLM-based coding assistants to generate source code from natural language, offers rapid prototyping and increased developer throughput but poses fundamental challenges for safe…
AMD CEO Lisa Su announced new data center GPUs and CPUs at the Advancing AI conference, including the Helios 72-GPU rack system with MI455 GPUs delivering up to 18× more tokens per dollar versus MI355…
Healthcare AI scaling faces structural barriers including data fragmentation, regulatory overhead, legacy infrastructure, and workflow gaps, according to a systems architecture analysis by an industry…
The DAC 2026 Engineering Track will feature ~90 peer-reviewed presentations from engineers designing AI accelerators, memory systems, and interconnects, with keynotes from Qualcomm EVP and CTO Baaziz …
The U.S. government on July 21st announced more than $5 billion in funding for the first projects under the national Genesis Mission to accelerate AI, but analyst Handel Jones of International Busines…
Siemens EDA's Fuse EDA AI system, discussed by Niranjan Sitapure, Jeff Dyck, and Ryan Silk, automates EDA tasks that once took hours into seconds, boosting productivity across the entire workflow by c…