Astera Labs announced the Leo X-Series fabric-attached memory controller plus next-generation Leo 2 E-Series and P-Series controllers, which support up to 4 TB of DDR5 capacity per controller and up t…
South Korean startup Xcena detailed its MX1 CXL Type 3 device at Hot Chips 2026, combining up to 2 TB of DDR5, SSD-backed InfiniteMemory capacity, and more than 1,000 custom RISC-V cores. Xcena chief …
Delos Data announced at the AI Infra Summit in Santa Clara, California, that it is developing Apollo, a data interface chiplet offered as a 30+ Tbps I/O chiplet next to an XPU, a 10+ Tbps near-package…
TSMC is introducing a new AI Design Kit (ADK) to enable AI-driven agentic workflows, announced at its Open Innovation Platform (OIP) event, according to Aveek Sarkar, director of ecosystem and allianc…
A new EE Times special report examines how AI-driven IoT sensors, ambient light harvesting, and edge AI are being deployed in building automation to enable real-time monitoring, predictive maintenance…
Global Unichip Corp. (GUC) announced on September 22, 2026 that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs, reaching data transfer speeds up to 16 Gbps o…
Quilter reported that a single engineer used its physics-driven AI platform to design a functioning two-board computer system in under a week with 38.5 hours of human input, versus a traditional estim…
Efficient Power Conversion (EPC) CEO Alex Lidow and VP Jason Zhang said at the EE Power Asia 2026 Spark Session that silicon MOSFETs have hit their performance ceiling for AI data center power, with e…
Infineon is promoting a multi-sensing approach to intelligent human-machine interface (HMI) design in which edge AI — on-device speech recognition and small language models — replaces cloud dependence…
Intel's OpenVINO Physical AI framework is being positioned to close the deployment gap for robotics foundation models, using the optimization of Physical Intelligence's π0.5 Vision-Language-Action mod…
Europe is "entirely supply constrained" on digital compute infrastructure, General Tensor chief investment officer Victor Teixeira said at the 12th European Blockchain Convention in Barcelona, citing …
Axis Communications, a professional security camera manufacturer with approximately 5,500 employees and about 90,000 system integration partners, is embedding AI analysis directly into its cameras via…
Indian medium- and small-scale manufacturers face inconsistent data, legacy equipment, and the absence of standard operating models as their main barriers to scaling AI, according to industry experts …
CEA, Defacto Technologies, and Innova Advanced Technologies announced the completion of SoC PLANNER, a three-year project funded by BPI France under the France 2030 program, now ready for early adopte…
Researchers at the Indian Institute of Technology (IIT) Bombay demonstrated an ultra-low-power neuromorphic neuron fabricated in standard GlobalFoundries 45-nm CMOS technology that consumed about 1,00…
Agentic AI accounted for roughly 28% of the 2026 Design Automation Conference (DAC) agenda, with 54 dedicated sessions and AI submissions rising from under 300 in 2023 to approximately 700, according …
Cincon released a line of high-performance power modules for edge AI and industrial PC (IPC) applications, including the CQB100W8-36S, an 8:1 wide 9-75V input DC-DC converter that delivers a full 100W…
Japanese researchers at the Institute of Science Tokyo have developed an indoor LED-based wireless power system that uses adaptive optics and AI-guided beam control to power IoT devices up to 5 meters…
BIWIN will showcase its enterprise and embedded storage solutions at embedded world North America 2026, September 22-24 at the Anaheim Convention Center, Booth #6104, highlighting products engineered …
Canada's Semiconductor Council (CSC) is urging the federal government to make semiconductors an explicit pillar of its AI strategy, arguing that sovereign AI requires sovereign silicon. In a position …