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Credo at OCP 2026: Micro-Emitter Optics and AI Interconnect Reliability

Credo previewed its 1.6T ZeroFlap Active Light Cable (ALC) at the OCP Global Summit in San Jose, with senior vice president of product Don Barnetson telling EE Times that AI interconnect priorities have shifted from speed to reliability as clusters scale. The ALC uses a standard OSFP pluggable to deliver copper-level reliability at reaches of up to 50 meters, with lower power, less weight and a thinner profile than copper, Barnetson said. Barnetson also described micro-emitter technology, which couples an array of optical emitters into hundreds or thousands of fibers and challenges the rule of "copper where you can, optics where you must.

read2 min views1 publishedNov 11, 2026
Credo at OCP 2026: Micro-Emitter Optics and AI Interconnect Reliability
Image: Eetimes (auto-discovered)

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At the OCP Global Summit in San Jose, Nitin Dahad of EE Times talks with Don Barnetson, senior vice president of product at Credo, about how AI interconnect needs are changing as clusters scale. With speed largely addressed, the focus has shifted to reliability: keeping millions of connections up and running and getting customers online quickly.

Barnetson explains micro-emitter technology, which couples an array of optical emitters into hundreds or thousands of fibers, and why it challenges the long-held rule of “copper where you can, optics where you must.” He also previews Credo’s 1.6T ZeroFlap Active Light Cable (ALC), which uses a standard OSFP pluggable to deliver copper-level reliability at reaches of up to 50 meters, with lower power, less weight, and a thinner profile than copper.

Watch for Barnetson’s take on what AI networks now require, why micro-emitter technology matters, and its path to market.

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