{"slug": "credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability", "title": "Credo at OCP 2026: Micro-Emitter Optics and AI Interconnect Reliability", "summary": "Credo previewed its 1.6T ZeroFlap Active Light Cable (ALC) at the OCP Global Summit in San Jose, with senior vice president of product Don Barnetson telling EE Times that AI interconnect priorities have shifted from speed to reliability as clusters scale. The ALC uses a standard OSFP pluggable to deliver copper-level reliability at reaches of up to 50 meters, with lower power, less weight and a thinner profile than copper, Barnetson said. Barnetson also described micro-emitter technology, which couples an array of optical emitters into hundreds or thousands of fibers and challenges the rule of \"copper where you can, optics where you must.", "body_md": "A free online environment where users can create, edit, and share electrical schematics, or convert between popular file formats like Eagle, Altium, and OrCAD.\nschematics.io\n\nFind the IoT board you’ve been searching for using this interactive solution space to help you visualize the product selection process and showcase important trade-off decisions.\ntransim.com/iot\n\nTransform your product pages with embeddable schematic, simulation, and 3D content modules while providing interactive user experiences for your customers.\ntransim.com/Products/Engage\n\nAspenCore Network\n\nA worldwide innovation hub servicing component manufacturers and distributors with unique marketing solutions\naspencore.com\n\nSiliconExpert provides engineers with the data and insight they need to remove risk from the supply chain.\nsiliconexpert.com\n\nTransim powers many of the tools engineers use every day on manufacturers' websites and can develop solutions for any company.\ntransim.com\n\nA free online environment where users can create, edit, and share electrical schematics, or convert between popular file formats like Eagle, Altium, and OrCAD.\nschematics.io\n\nFind the IoT board you’ve been searching for using this interactive solution space to help you visualize the product selection process and showcase important trade-off decisions.\ntransim.com/iot\n\nTransform your product pages with embeddable schematic, simulation, and 3D content modules while providing interactive user experiences for your customers.\ntransim.com/Products/Engage\n\nAbout\n\nA worldwide innovation hub servicing component manufacturers and distributors with unique marketing solutions\naspencore.com\n\nSiliconExpert provides engineers with the data and insight they need to remove risk from the supply chain.\nsiliconexpert.com\n\nTransim powers many of the tools engineers use every day on manufacturers' websites and can develop solutions for any company.\ntransim.com\n\n\"Partner Content\"\nallows today's industry thought leaders to share their unique insight and perspective with the\ngreater ASPENCORE audience. Material published as \"Partner Content\" was created by or on behalf of ASPENCORE's partner(s)\nin conjunction with the ASPENCORE Studio team and may not reflect the views of the site and editors to which it is published.For\nmore information on this program, email\nsupport@aspencore.com\n\nAt the OCP Global Summit in San Jose, Nitin Dahad of EE Times talks with Don Barnetson, senior vice president of product at Credo, about how AI interconnect needs are changing as clusters scale. With speed largely addressed, the focus has shifted to reliability: keeping millions of connections up and running and getting customers online quickly.\n\nBarnetson explains micro-emitter technology, which couples an array of optical emitters into hundreds or thousands of fibers, and why it challenges the long-held rule of “copper where you can, optics where you must.” He also previews Credo’s 1.6T ZeroFlap Active Light Cable (ALC), which uses a standard OSFP pluggable to deliver copper-level reliability at reaches of up to 50 meters, with lower power, less weight, and a thinner profile than copper.\n\nWatch for Barnetson’s take on what AI networks now require, why micro-emitter technology matters, and its path to market.", "url": "https://wpnews.pro/news/credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability", "canonical_source": "https://www.eetimes.com/credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability/", "published_at": "2026-11-11 18:01:33+00:00", "updated_at": "2026-11-11 18:24:39.885752+00:00", "lang": "en", "topics": ["ai-infrastructure", "ai-chips"], "entities": ["Credo", "Don Barnetson", "OCP Global Summit", "EE Times", "Nitin Dahad", "ZeroFlap Active Light Cable", "OSFP"], "also_reported_by": [], "alternates": {"html": "https://wpnews.pro/news/credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability", "markdown": "https://wpnews.pro/news/credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability.md", "text": "https://wpnews.pro/news/credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability.txt", "jsonld": "https://wpnews.pro/news/credo-at-ocp-2026-micro-emitter-optics-and-ai-interconnect-reliability.jsonld"}}