High Bandwidth Flash (HBF), a NAND-based memory stack with read bandwidth comparable to HBM4 but 10x the capacity, is set to sample from Sandisk in late 2026 and appear in AI inference devices by earl…
Kioxia and Sandisk have begun sampling their tenth-generation 3D NAND BiCS chips with 332 layers, featuring 1 Tbit TLC chips for enterprise and data center SSDs. The new technology introduces CMOS dir…
Kioxia has begun sampling its tenth-generation 332-layer 3D NAND BiCS chips, featuring 1 Tbit TLC capacity and a 4.8 Gbit/s interface speed. The technology introduces CMOS directly Bonded to Array and…
Chinese AI and chip companies Moore Threads, MetaX, and Biren Technology have raised billions in IPOs on the Shanghai STAR Market and Hong Kong Exchange, with first-day gains exceeding 400% and oversu…
Yangtze Memory Technologies Corporation (YMTC) surged to 13% of the global NAND flash market in Q1 2026, tying with SanDisk and Micron, driven by AI-fueled demand and nearly 445% year-over-year revenu…
Micron Technology acknowledged the growing capabilities and market share of China's ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies Corp (YMTC) during an earnings call, validating …
ChangXin Memory Technologies (CXMT) won approval last week for a nearly 30-billion-yuan ($4.4 billion) IPO in Shanghai, while Yangtze Memory Technologies Corp. (YMTC) has begun IPO preparations and co…
Samsung has built a 900-layer 3D NAND die by stacking two 450-layer strings together, far surpassing competitors who currently produce 192- to 321-layer chips. The research device’s cells function cor…
Huawei has developed proprietary Die-on-Board (DoB) packaging technology to produce 122 TB SSDs, circumventing its inability to access the latest 100+ layer 3D NAND from mainstream suppliers due to US…