Sylvie Gellida

CEA-Leti CEO Sébastien Dauvé told the LID World Summit 2026 in Grenoble, held June 23-25, that architecture—not raw compute—is AI's emerging bottleneck, with data movement, interconnects, power conver…

STMicroelectronics is ramping its PIC100 silicon photonics platform on 300-mm wafers to address the growing demand for optical interconnects in AI data centers, where copper links are reaching limits …