EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More
Intel, TSMC, SK Hynix, Samsung, Micron, Marvell, Lightmatter, and Microsoft disclosed advanced packaging technologies at ECTC 2026, including Intel's EMIB-T with 36/35 µm bump pitch and plans for 25 µ…