ASE Technology

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// recent coverage 2 mentions

07:47

2026-09-01

eetimes.com

artificial-intelligence

SK Hynix’s $4B HBM Project Targets U.S. Chipmaking Gap

SK Hynix's first U.S. high-bandwidth memory (HBM) advanced packaging facility, a $4 billion project in Indiana, will begin commercial production of HBM4E chips in the second half of 2029, aiming to cl…

08:22

2026-06-24

startupfortune.com

artificial-intelligence

ASE Technology raises its 2026 capex to $8.5 billion as AI chip packaging demand overwhelms supply

ASE Technology raised its 2026 capital expenditure target to $8.5 billion, up from $7 billion in February, as AI chip packaging demand continues to outpace supply. The company expects its advanced pac…

// co-occurs with top 8 entities

TSMC 2 Nvidia 1 AMD 1 Broadcom 1 Joseph Tung 1 Kaohsiung 1 CoWoS 1 SK Hynix 1

// topics top 3 topics

artificial intelligence 2 ai chips 2 ai infrastructure 2