XRing O3

Arm announced its new C2-Ultra and C2-Pro CPU cores and Mali G2-Ultra NX GPU for Android chips, claiming up to 15% higher single-thread performance, 12% faster app launches, and up to 1.7x performance…

At IFA 2026 in Berlin (September 4–8), Xiaomi unveiled the Xiaomi 18 Fold, its first flagship powered by the XRing O3 chip with LPDDR6 memory up to 12,800Mbps, ahead of a China launch on September 7, …

Xiaomi introduced its in-house XRing O3 processor, built on TSMC's 3nm N3P process, which will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max in September. The chip features an all-big-core CPU,…