Huawei unveiled the Ascend 960 SuperPoD at HUAWEI CONNECT 2026, which the company says is the industry's first SuperPoD to use Near-Packaged Optics (NPO) technology, supporting up to 4,096 NPU cards w…
Huawei Technologies rotating chairman David Wang announced on Thursday that the company will release two new AI chips in 2027 — the Ascend 960DT in the first quarter and the Ascend 960PR in the third …
Huawei Technologies will launch two new artificial-intelligence semiconductors in 2027, rotating chairman David Wang said on Thursday, with the 960DT due in the first quarter and the Ascend 960PR in t…
Huawei Technologies unveiled its Ascend 960 SuperPoD computing cluster and an upgraded UnifiedBus interconnect technology at the Huawei Connect 2026 conference in Shanghai on Thursday, saying the comb…
At MWC Barcelona 2026, Huawei unveiled its latest SuperPoD products, including the Atlas 950 SuperPoD and TaiShan 950 SuperPoD, and fully open-sourced its CANN heterogeneous compute architecture. The …