AMD is adding Universal Chiplet Interconnect Express (UCIe) support to its Versal line of adaptive programmable chips, initially extending support to its RF Versal products with production chiplets ex…
Intel Corporation unveiled three architectures for Agentic AI at Hot Chips 2026: the Diamond Rapids processor, Crescent Island GPU, and Wildcat Lake SoC, built on Intel 18A process and Foveros Direct …
Sandisk and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project on August 3-4, defining an open framework for NAND-based near-compute memory…
Sandisk and SK hynix have published the first open technical specification for High Bandwidth Flash (HBF) through the Open Compute Project, creating a new memory tier between High Bandwidth Memory and…
SK Hynix and Sandisk unveiled the first standard specifications for high bandwidth flash (HBF), a next-generation memory technology designed to address supply chain constraints of high bandwidth memor…
Valeo System Architecture and Strategy Manager Frank Moesle told the 2026 Embedded Vision Summit that the automotive industry is transitioning from decentralized ECUs to zonal and central compute arch…