Solidigm

SK Telecom will invest 738.4 billion won ($477 million) in SK hynix's US-based AI investment vehicle, SK hynix NAND Product Solutions, to strengthen cooperation among SK Group affiliates in AI data ce…

Samsung has built a 900-layer 3D NAND die by stacking two 450-layer strings together, far surpassing competitors who currently produce 192- to 321-layer chips. The research device’s cells function cor…

Samsung is developing a new class of nearline SSDs with capacities ranging from 250 TB to 1 PB in E3L or E2 form factors, according to Scality. The drives use a new flash technology with five times le…