Rambus

Intel CEO Lip-Bu Tan signaled a return to memory chip innovation, saying memory is no longer a commodity and that Intel is exploring stacking DRAM on CPUs, amid industry expectations that memory short…

Renesas Electronics has unveiled its Gen 3 DDR5 multiplexed rank dual in-line memory module (MRDIMM) chipset, delivering speeds up to 16,000 MT/s and 25% higher memory bandwidth than its Gen 2, to add…