Intel's EMIB packaging technology is gaining traction as TSMC's CoWoS advanced packaging lines are booked through 2027, with Google committing to order more than 3 million units of Intel's EMIB-T for …
ChipAgents closed a $60 million Series A2 round on July 29, bringing its total Series A to $134 million, with chipmakers Micron and MediaTek among the backers. The company's multi-agent platform compr…
Intel's EMIB (Embedded Multi-die Interconnect Bridge) packaging technology has secured Google, Amazon, Cisco, SpaceX, and Tesla as external customers, with Google adopting EMIB-T for its 9th-generatio…
TSMC is developing a new chip packaging technology called CoPoS (Chip-on-Panel-on-Substrate) that replaces traditional circular 300mm wafers with rectangular 310×310 mm panels to increase usable surfa…
OpenAI president Greg Brockman confirmed the company is building 'a family of devices' that will arrive 'soon,' centered on voice interaction with ChatGPT rather than typing. Brockman dismissed Apple'…
ChipAgents, the AI semiconductor design startup founded by University of California, Santa Barbara professor William Wang, has raised $60 million in new financing, Reuters reported on July 29th, follo…
ChipAgents has secured an additional $60 million in Series A2 financing, expanding its Series A round to $134 million, as the company's AI agents for semiconductor design are deployed at over 120 chip…
ChipAgents, a startup building AI agents that design and test semiconductors and a partner of Nvidia, has raised $60 million, bringing its total funding to roughly $134 million in under a year. The co…
Chip design startup ChipAgents has raised an additional $60 million to expand its Series A round, bringing total funding to $131 million, to accelerate semiconductor development with autonomous AI age…
ChipAgents, an AI startup, extended its Series A funding to $134 million with backing from Micron and MediaTek, driven by sixfold annual recurring revenue growth.…
OpenAI's first hardware device is a portable, screenless AI smart speaker co-developed with former Apple design chief Jony Ive, expected in early 2027 at a price between $200 and $300. The company is …
South Korea's KOSPI index sank more than 10% on Tuesday as shares in memory-chip giants Samsung Electronics and SK Hynix plunged as much as 13.4% and 14%, respectively, driven by investor concerns ove…
Qualcomm will raise smartphone processor prices by a double-digit percentage after September 1, driven by rising manufacturing and memory costs that have increased smartphone bill-of-materials costs b…
A leak from Mystic Leaks suggests Google's Pixel 11a will feature a flagship-grade Tensor G6 processor, reversing the Pixel 10a's downgrade to a previous-generation chip. The Tensor G6 is also rumored…
The Lenovo Chromebook Plus 14, priced at $1,269.99, offers a premium build with an OLED touch screen and a MediaTek Kompanio Ultra 910 processor featuring a 50 TOPS NPU, but its high cost and middling…
Microsoft is hiring engineers and researchers for its Future AI Infrastructure (FAI) team in Cambridge, England, to develop optical and photonic interconnects aimed at breaking through bandwidth, late…
Chinese AI company StepFun has unveiled the StepX Neo, calling it the world's first 'large-model native agentic smartphone' built around AI from the ground up. The device runs on StepFun's native Step…
Morgan Stanley analysts led by Joseph Moore defended Broadcom's role in Google's TPU supply chain, projecting TPU shipments will reach 3.2 million units in 2026 and 5 million in 2027, with the partner…
OpenAI's first consumer device will be a portable smart speaker without a screen, designed as a humanlike AI companion for the home, according to a Bloomberg report. The device, still in development, …
OpenAI still plans to announce its AI hardware this year and launch it in 2027, according to Bloomberg's Mark Gurman, despite a lawsuit from Apple accusing OpenAI and two former Apple employees of ste…