LG Innotek is partnering with Japan's TDK to develop next-generation vision and tactile sensing modules for physical AI, with the first inertial sensor-equipped module targeted for 2027 and a tactile …
LG Innotek has formed a strategic partnership with Japan's TDK to jointly develop next-generation vision and tactile sensing modules for humanoid robots and physical AI applications, the companies sai…
LG Innotek targets $647 million in operating profit from package solutions by 2031, driven by 5G, premium smartphone components, memory market recovery, and AI expansion.…
SAP Korea will host the SAP NOW AI Tour Korea event on July 14, 2026, at the Grand InterContinental Seoul Parnas, introducing the SAP Business AI Platform and SAP Autonomous Suite. Keynotes will be de…
Senior LG Group executives will meet Nvidia officials at Nvidia's headquarters in Santa Clara, California, to discuss physical AI and robotics, following a recent meeting between LG Chairman Koo Kwang…
LG Innotek aims to generate 1 trillion won ($662 million) in operating profit from its chip substrate business by 2031, exceeding the entire group's 2025 earnings, driven by AI demand. The division, l…
LG Innotek is jointly developing a 120mm ultra-large flip-chip ball grid array (FC-BGA) substrate with a North American big-tech customer, aiming to complete development next year and pursue mass prod…
LG Innotek is co-developing large semiconductor substrates for AI with a North American Big Tech firm, expecting tangible results by year-end. The company targets over 1 trillion won in annual operati…
Samsung, LG and SK are racing to develop glass substrates for AI chip packaging, but mass production remains elusive due to manufacturing challenges. SKC's US subsidiary Absolics aims to be first to m…