LG Innotek is showcasing its latest semiconductor substrate technology this week at KPCA show 2026, a three-day industry exhibition that opened Wednesday at Songdo Convensia in Incheon. Now in its 23rd year, the show — organized by the Korea PCB and Semiconductor Packaging Industry Association, known as KPCA — is Korea's largest trade exhibition dedicated to printed circuit boards and semiconductor packaging, drawing roughly 350 domestic and international companies. LG Innotek's exhibit centers on FC-BGA, or flip chip-ball grid array, a high-end substrate that links semiconductor chips to a device's mainboard. The company unveiled for the first time an FC-BGA built for artificial intelligence (AI) accelerators — chips such as graphics processing units and neural processing units that handle large volumes of data at high speed. The new substrate measures more than 100 millimeters per side and required denser circuitry than standard versions. LG Innotek said it aims to begin mass production of the substrate in 2027. Also on display were chip embedding technology, which places a chip
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