HBM3e

Microsoft unveiled the architecture of its second-generation Maia 200 AI accelerator at Hot Chips 2026, a 3nm chip with 140 billion transistors, 750W TDP, and 10,000 TFLOPS of FP4 performance, designe…

Nvidia is raising prices on its AI hardware, including Blackwell and Hopper architectures, by over 15 percent due to manufacturing yield issues, high-bandwidth memory (HBM3e) supply costs, and demand …

South Korea is restructuring its workforce as top students shift from law and medicine to electrical engineering and materials science, driven by the AI chip boom and HBM demand, with pay gaps reversi…