Qualcomm unveiled High Bandwidth Compute (HBC), a near-memory 3D-stacked accelerator architecture, at its June 24, 2026 Investor Day. The company claims HBC delivers a 6x bandwidth-per-watt increase o…
Qualcomm announced the Dragonfly data center ecosystem and AI300 inference accelerator at its Investor Day on June 23-24, 2026, claiming up to 54x effective memory bandwidth per card and 3-8x tokens-p…
Qualcomm announced a target to grow data center revenue from $0.3 billion in fiscal 2026 to over $15 billion by fiscal 2029, driven by a multi-generation agreement with Meta and custom silicon deals w…
Qualcomm expanded its partnership with Hugging Face on June 24 to make over 3 million open AI models deployable across its hardware, including Snapdragon, Dragonwing, and Dragonfly platforms. The coll…