Intel Corp. unveiled a three-pronged hardware strategy at the Hot Chips 2026 conference, positioning agentic AI as a system-level workload requiring CPUs, GPUs, memory, interconnects, and advanced pac…
AMD announced that its upcoming Versal adaptive SoCs will natively support Universal Chiplet Interconnect Express (UCIe) 1.1 interfaces, with the Versal RF Series first to feature up to four UCIe-SP a…
At Hot Chips 2026, Intel unveiled three silicon platforms for enterprise agentic AI: Diamond Rapids, a next-generation Xeon with up to 256 cores and 1.28GB LLC; Crescent Island, a 350-watt air-cooled …
Intel Corporation unveiled three architectures for Agentic AI at Hot Chips 2026: the Diamond Rapids processor, Crescent Island GPU, and Wildcat Lake SoC, built on Intel 18A process and Foveros Direct …