09:00
2026-09-08
asiaai.fyi
ai-infrastructure
Winbond’s Chip Testing Outlook: Why Capacity Bottlenecks—Not a Bubble—Limit AI Supply
Winbond VP Chen Shao-kun said at SEMICON Taiwan 2026 that AI demand is not a bubble but a supply chain capacity bottleneck, citing continued capital expenditure by wafer fabs, advanced packaging, test…