Winbond VP Chen Shao-kun said at SEMICON Taiwan 2026 that AI demand is not a bubble but a supply chain capacity bottleneck, citing continued capital expenditure by wafer fabs, advanced packaging, test…
The Roundhill Memory ETF (CBOE:DRAM) faces its biggest risk from structural concentration, with its top three holdings—Samsung Electronics at 24.99%, SK hynix at 24.22%, and Micron Technology at 23.83…
JPMorgan strategist Jay Kwon predicts the AI-driven memory chip shortage will persist for another two years, with demand broadening from GPUs to CPUs, and remains bullish on memory stocks despite a 25…
TSMC and Winbond are collaborating to build a localized DRAM supply chain in Taiwan using 3D wafer-on-wafer stacking technology, targeting edge AI workloads. The partnership leverages Winbond's CUBE a…
AI data centers are consuming the global supply of high-bandwidth memory, causing a DRAM shortage that is driving up prices for legacy memory standards like DDR2 and DDR3. Hardware manufacturers are r…